...D. Spicer; K. Lai; K. Kornelsen; A. Brennan; N. Belov; M. Wang; T‐K. Chou; J. Heck; T. Zhu; S. Akhlaghi Purpose The purpose of this paper is to characterize pressure non‐uniformity in a wafer‐to‐wafer bond chamber using pressure sensitive paper. Design/methodology/approach Pressure non...

...Hui Xu; Changqing Liu; Vadim V. Silberschmidt; Zhong Chen; Jun Wei Purpose Optimization of the process parameters remains a challenging task in thermosonic wire bonding due to relatively poor understanding of the bonding mechanism. The purpose of this paper is to understand initial bond formation...

..., “d₁” is smaller than “d₂” Yung‐Yu Hsu can be contacted at: hsu@imec.be © Emerald Group Publishing Limited 2010 Deformation Material‐deforming processes Bonding Films (states of matter) Elastomers The electromechanical properties of the zigzag...

...Z.W. Zhong Purpose The purpose of this paper is to review recent advances in fine and ultra‐fine pitch wire bonding. Design/methodology/approach Dozens of journal and conference articles published recently are reviewed. Findings The problems/challenges such as possible wire sweep...

...Z.W. Zhong Purpose The purpose of this paper is to review recent advances in wire bonding of low‐k devices. Design/methodology/approach Dozens of journal and conference articles published in 2005‐2008 are reviewed. Findings The paper finds that many articles have discussed...

...W.D. van Driel; R.B.R. van Silfhout; G.Q. Zhang Purpose At present, over 95 percent of the manufactured packages are still being wire bonded. Owing to the ongoing trend of miniaturization, material changes, and cost reduction, wire bond‐related failures are becoming increasingly important...

...Z.W. Zhong Purpose This paper attempts to review recent advances in wire bonding using insulated wire and new challenges in wire bonding for advanced microelectronics packaging. Design/methodology/approach Dozens of journal articles, conference articles and patents published or issued in 2004...

...Narasimalu Srikanth Purpose Wire bonding is an important method of interconnection in microelectronics. Ultrasonic energy is known to soften metallic materials and hence when used in the wire bond process it is effective to decrease the flow stress similar to thermal energy. The paper aims...

...Tan Chee Wei; Abdul Razak Daud A Cu‐Al bonding system exists when copper wire is bonded onto an aluminum bond pad using thermosonic wire bonding technology. Aged Cu‐Al bonding system was analyzed by measuring the intermetallics layer thickness and its correlation to electrical contact resistance...

... In vertical ultrasonic format the PESL DB5 - TSV unit offers accuracy of 2-3µM and very low force on the chip. The unit was developed especially for small chips with gold contacts- generally these have required high force to adequately bond with vibration transmitted across the chip. However...

... bond head in the world with an additional integrated wire clamp,bringing numerous advantages. No more limitation on the width or strength of the ribbon to be bonded; ribbon of 125 micron width and more can now be bonded trouble-free. The upper, more powerful clamp serves solely to tear-off the wire...

... interconnections was tested in thermal cycling and humidity tests. © MCB UP Limited 2001 Flip chip Bonding Chip on flex (COF) is a very interesting and promising interconnection method that can be used especially in portable electronics products like mobile phones, portable terminals, pagers...

... © MCB UP Limited 2001 --> Sonoscan Bonding Imaging Sonoscan imaging permits bonded wafer rework Keywords: Sonoscan, Bonding, Imaging Users of the Sonoscan's new AW2000 system for automated bonded wafer inspection report that susbtantial economies are realized...

... Institute receives S.E.C. bonder for manufacturing classwork Keyword: Bonding Semiconductor Equipment Corporation has announced that the American Competitive Institute in Philadelphia, Pennsylvania is using one of S.E.C.'s Model 850 flip chip bonders as a teaching aid...

..., when the bonding parameters were optimised. This paper discusses flip chip on FR‐4 and ceramic substrates using non‐conductive adhesive (NCA), anisotropic conductive film (ACF), or anisotropic conductive paste (ACP). Research and development of flip chip on FR‐4 and ceramic substrates using gold...

... © MCB UP Limited 2001 --> Kulicke and Soffa Bonding New automatic ribbon bonder offers industry's fastest wire cycles Keywords Kulicke and Soffa, Bonding The K&S Triton wedge bonder platform shown for the first time at Semicon Europa is built around Kulicke...

... © MCB UP Limited 2001 --> Microjoin Bonding LCD assembly gains through-put increase with Micro Join 4200 Series Bonders Keywords: Microjoin, Bonding Micro Join, Inc., (formerly Hughes and Palomar Technologies) has announced the high production through-put...

... © MCB UP Limited 2000 --> F&K Delvotec Testing Bonding New automatic pulltester from F&K Delvotec Keywords F&K Delvotec, Testing, Bonding The new automatic pulltester complements the die and wire bonders from F&K. The PC controlled moving table...

... © MCB UP Limited 2000 --> Karl Suss Flip chip Bonding Keywords Karl Suss, Flip chip, Bonding The new FC250 Flip Chip Bonder from Karl Suss made its official market debut on 25 November, as the Fraunhofer Institute (Berlin) took delivery of the first SUSS FC250. Strong...

... © MCB UP Limited 2000 --> Semiconductor Equipment Corporation Flip chip Bonding Keywords Semiconductor Equipment Corporation, Flip chip, Bonding Semiconductor Equipment Corporation has designed a new rapid heat pick-up head for the company's line of flip chip bonders...