...D. Spicer; K. Lai; K. Kornelsen; A. Brennan; N. Belov; M. Wang; T‐K. Chou; J. Heck; T. Zhu; S. Akhlaghi Purpose The purpose of this paper is to characterize pressure non‐uniformity in a wafer‐to‐wafer bond chamber using pressure sensitive paper. Design/methodology/approach Pressure non...

...Hui Xu; Changqing Liu; Vadim V. Silberschmidt; Zhong Chen; Jun Wei Purpose Optimization of the process parameters remains a challenging task in thermosonic wire bonding due to relatively poor understanding of the bonding mechanism. The purpose of this paper is to understand initial bond formation...

... is, for the first time, proven as a promising design for stretchable interconnects, especially for fine pitch applications. Yung‐Yu Hsu can be contacted at: hsu@imec.be © Emerald Group Publishing Limited 2010 Deformation Material‐deforming processes Bonding Films (states of matter) Elastomers...

...Z.W. Zhong Purpose The purpose of this paper is to review recent advances in fine and ultra‐fine pitch wire bonding. Design/methodology/approach Dozens of journal and conference articles published recently are reviewed. Findings The problems/challenges such as possible wire sweep...

...Z.W. Zhong Purpose The purpose of this paper is to review recent advances in wire bonding of low‐k devices. Design/methodology/approach Dozens of journal and conference articles published in 2005‐2008 are reviewed. Findings The paper finds that many articles have discussed...

...Z.W. Zhong Purpose This paper attempts to review recent advances in wire bonding using insulated wire and new challenges in wire bonding for advanced microelectronics packaging. Design/methodology/approach Dozens of journal articles, conference articles and patents published or issued in 2004...

...W.D. van Driel; R.B.R. van Silfhout; G.Q. Zhang Purpose At present, over 95 percent of the manufactured packages are still being wire bonded. Owing to the ongoing trend of miniaturization, material changes, and cost reduction, wire bond‐related failures are becoming increasingly important...

...Narasimalu Srikanth Purpose Wire bonding is an important method of interconnection in microelectronics. Ultrasonic energy is known to soften metallic materials and hence when used in the wire bond process it is effective to decrease the flow stress similar to thermal energy. The paper aims...

...Tan Chee Wei; Abdul Razak Daud A Cu‐Al bonding system exists when copper wire is bonded onto an aluminum bond pad using thermosonic wire bonding technology. Aged Cu‐Al bonding system was analyzed by measuring the intermetallics layer thickness and its correlation to electrical contact resistance...

... The vertical ultrasonic head enables improved planar attachment of very fragile chips such as galium arsonide and for some of the very small microwave chips presently in development. Conventional gold bump chips can then be bonded using either horizontal or vertical ultrasonics, involving only...

... © MCB UP Limited 2001 --> Bonding F&K Delvotec New developments from F&K Delvotec Keywords: Bonding, F&K Delvotec High speed, heavy wire bonder model 6600; speed and precision in perfect union This new, improved heavy wire bonder works over 25 per...

... © MCB UP Limited 2001 --> Bonding Institute receives S.E.C. bonder for manufacturing classwork Keyword: Bonding Semiconductor Equipment Corporation has announced that the American Competitive Institute in Philadelphia, Pennsylvania is using one of S.E.C.'s Model...

..., when the bonding parameters were optimised. © MCB UP Limited 2001 Flip chip Adhesives Bonding Reliability Many simple, low cost and low‐temperature processes for flip chip assemblies have been developed (Lau, 1995; Kloeser et al., 1997; Zhong, 1999; Zhong et al...

... are that it is a lead free and fluxless process, the process temperature is lower, no underfill is needed and the interconnection density can be higher. The disadvantages and limitations of ACA process are that the pressure is required during the whole bonding process and high accurate flip chip bonders are required...

... © MCB UP Limited 2001 --> Sonoscan Bonding Imaging Sonoscan imaging permits bonded wafer rework Keywords: Sonoscan, Bonding, Imaging Users of the Sonoscan's new AW2000 system for automated bonded wafer inspection report that susbtantial economies are realized...

... New automatic ribbon bonder offers industry's fastest wire cycles Keywords Kulicke and Soffa, Bonding The K&S Triton wedge bonder platform shown for the first time at Semicon Europa is built around Kulicke & Soffa's industry leading technology and will further advance wedge...

... © MCB UP Limited 2001 --> Microjoin Bonding LCD assembly gains through-put increase with Micro Join 4200 Series Bonders Keywords: Microjoin, Bonding Micro Join, Inc., (formerly Hughes and Palomar Technologies) has announced the high production through-put...

... © MCB UP Limited 2000 --> F&K Delvotec Testing Bonding New automatic pulltester from F&K Delvotec Keywords F&K Delvotec, Testing, Bonding The new automatic pulltester complements the die and wire bonders from F&K. The PC controlled moving table...

...Zhaowei Zhong Discusses three simple and low‐cost flip chip assembly processes. First, flip chip on board using non‐conductive adhesive is evaluated. This process can give reasonable reliability and high assembly yield, when the parameters for epoxy placement and bonding are optimised. Second...

... © MCB UP Limited 2000 --> Semiconductor Equipment Corporation Bonding Keywords Semiconductor Equipment Corporation, Bonding Semiconductor Equipment Corporation has enhanced the means of achieving pick and place precision of the company's semiautomatic Model 860 Omni...