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1-8 of 8
Keywords: Electronic equipment and components
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2008) 25 (3): 3–13.
Published: 25 July 2008
... measurement Electronic equipment and components Simulation Modelling It may take a considerably long time (several minutes) for a package from the moment power supplies connected to the package to the moment it reaches its steady state conditions. This may depend on the material properties...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2008) 25 (2): 3–8.
Published: 18 April 2008
... semiconductors, which are of interest for applications in high temperature/power electronic devices. L.S. Chuah can be contacted at: chuahleesiang@yahoo.com © Emerald Group Publishing Limited 2008 Radiofrequencies Electronic equipment and components III‐nitride semiconductors...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2007) 25 (1): 21–24.
Published: 28 December 2007
... the normal operation of the electronic device and the model accuracy is investigated at high temperature. C. Salame can be contacted at:salame@ul.edu.lb © Emerald Group Publishing Limited 2008 Electronic equipment and components Numerical analysis Temperature Microelectronics...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2007) 24 (3): 27–33.
Published: 31 July 2007
... Emerald Group Publishing Limited 2007 MEMS Electronic equipment and components Ceramics With the development of MEMS technology, miniaturisation technology is rapidly expanding into biological research as well as clinical and medical research. The miniaturisation of the components...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2007) 24 (1): 35–39.
Published: 02 January 2007
... characteristics of microstrip rejection filter without overlay and schematic of rejection filter showing overlay © Emerald Group Publishing Limited 2007 Microwave circuits Electronic equipment and components Thin films The development of ferrite films and device designs that employ...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2007) 24 (1): 40–45.
Published: 02 January 2007
... reduction in different nano‐sized CMOS driven RLC‐modeled interconnects. B.K. Kaushik can be contacted at: brajesh_k_k@yahoo.com; bkk10dec@iitr.ernet.in © Emerald Group Publishing Limited 2007 Voltage fluctuations Electronic equipment and components Simulation The feature size...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2006) 23 (2): 32–36.
Published: 01 May 2006
... provides an alternative approach to address the problem of part obsolescence. This paper shows that proper uprating leads to cost saving while continuing to provide reliable service. © Emerald Group Publishing Limited 2006 Obsolescence Electronic equipment and components Semiconductors...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2006) 23 (2): 11–20.
Published: 01 May 2006
... useful to design bonding wires for automotive electronic modules. © Emerald Group Publishing Limited 2006 Automotive industry Product reliability Electronic equipment and components Automotive electronics design and manufacture presents unique challenges for product reliability...
