...Yap Boon Kar; Noor Azrina Talik; Zaliman Sauli; Foong Chee Seng; Tan Chou Yong; Vithyacharan Retnasamy Purpose This paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the flux residue...

.... As the interconnection technology for flip chip package is getting finer and smaller, it is extremely difficult to obtain the accurate values of thermal stresses by direct experimental measurements. Different types of solder bumps used for interconnection would also influence the thermal distribution within the package...

... © MCB UP Limited 2003 --> MRSI Flip chip Capillary underfill dispenser introduced for the flip chip market Keywords: MRSI, Flip chip MRSI has announced the addition of a new underfill system to its 175 product line of dispense systems with the introduction...

...Michael A. Previti; Peter Ongley No‐Flow or fluxing underfills will play a key role in the future of flip chip processing. Properly formulated No‐Flow Underfills decrease manufacturing time and cost of producing flip chip packages. The reliability and processing ability allows these underfills...

...A. Cordery; N. Kilbey; N. Suthiwongsunthorn The present paper discusses the development of a test methodology for evaluation of the electrical performance of flip‐chip devices. A dedicated test chip was designed for this experiment. The test structure contains passive and active semiconductor...

...C.Y. Huang The underfilling of flip chip components with the encapsulant is based on the principles of capillary flow. A reasonable understanding of capillary flow and an effective estimate of the encapsulant's flow time will help develop a robust process. Factors which may influence...

... a quick and simple change of the active head unit. Without either ultrasonic head the DB5 is a very accurate flip chip pick and place machine for normal reflow, or for pick, epoxy, place and reflow. In vertical ultrasonic format the PESL DB5 - TSV unit offers accuracy of 2-3µM and very low force...

...Zhaowei Zhong This paper discusses flip chip on FR‐4 and ceramics using non‐conductive adhesive (NCA), anisotropic conductive film (ACF), or anisotropic conductive paste (ACP). Several ACF and ACP materials with different types of adhesive resin and conductive particles and one NCA material were...

...Petteri Palm; Jarmo Määttänen; Alain Picault; Yannick De Maquillé This paper presents the results from the evaluation of different types of flexible substrates for high‐density flip chip application. In this work two different types of base materials were used, epoxiglass (EG) and polyimide (PI...

...Zhaowei Zhong A reliable packaging process for flip chip on ceramic substrate using gold bumps and adhesive was successfully developed. The bonding parameters and flip chip assemblies using four adhesive materials were investigated by means of design of experiments and yield runs. The packaging...

... © MCB UP Limited 2001 --> Flip chip Internet Free flip chip information Keywords: Flip chip, Internet www.FlipChips.com is a free source of information to help flip chip users choose the best processes, find the right suppliers, and keep up with this rapidly...

... © MCB UP Limited 2000 --> MRSI Flip chip Assembly Microelectronic modules MRSI-505 combines flip chip bonding and delicate GaAs handling Keywords MRSI, Flip chip, Assembly, Microelectronic modules MRSI has developed an innovative process combining delicate GaAs...

... © MCB UP Limited 2000 --> Quad systems Dies Handling Flip chip 12 Micron, 3 Sigma repeatability now available from Quad; Quad debuts enhanced small die handling option for APS-1 and APS-1H Keywords Quad systems, Dies, Handling, Flip chip Quad Systems...

... © MCB UP Limited 2000 --> Unitive Flip chip Bumping Keywords Unitive, Flip chip, Bumping Unitive Advanced Semiconductor Packaging announces the release to manufacturing of a low alpha count flip chip bumping process for both eutectic(63/37) and high-lead (95/5) solder...

...Zhaowei Zhong Discusses three simple and low‐cost flip chip assembly processes. First, flip chip on board using non‐conductive adhesive is evaluated. This process can give reasonable reliability and high assembly yield, when the parameters for epoxy placement and bonding are optimised. Second...

... © MCB UP Limited 2000 --> Kulicke & Soffa Amkor Technology Flip chip Electronics industry Keywords Kulicke & Soffa, Amkor Technology, Flip chip, Electronics industry Kulicke & Soffa Industries, Inc. and Amkor Technology, Inc. have announced a ten-year...

... Driving the growth in flip chip packaging is increasing demand for high performance handheld applications such as RF wireless communications and high-speed network systems. Flip chip die accounts for 1.5 per cent of the 60 billion IC circuits produced worldwide, but is expected to grow...

... © MCB UP Limited 2000 --> Amkor Technology Unitive Licensing Flip chip Keywords Amkor Technology, Unitive, Licensing, Flip chip Amkor Technology, Inc. and Unitive Advanced Semiconductor Packaging have signed a ten-year technology transfer and licensing agreement...

... © MCB UP Limited 2000 --> Semiconductor Equipment Corporation Flip chip Bonding Keywords Semiconductor Equipment Corporation, Flip chip, Bonding Semiconductor Equipment Corporation has designed a new rapid heat pick-up head for the company's line of flip chip bonders...

... in the marketplace. To learn more about Karl Suss and its full line of products, please visit the Web site at www.suss.com or www.suss.de © MCB UP Limited 2000 --> Karl Suss Flip chip Bonding Keywords Karl Suss, Flip chip, Bonding The new FC250 Flip Chip Bonder from Karl Suss...