...Philip Pieters; Walter De Raedt; Eric Beyne The thin film multilayer multichip module technology (MCM‐D) was originally used for the interconnection of high speed digital circuits in a single module. Nowadays, the technology is more and more evolving towards use in the interconnection of RF...

... © MCB UP Limited 1999 --> Conference IMAPS Multichip module IMAPS expands scope of Denver conference and gives it a new name Keywords Conference, IMAPS, Multichip module IMAPS has changed the name of its MCM Conference to the International Conference...

... method of coupled transmission lines in order to eliminate the errors and insufficient validity of DC direct measurements. Interconnection Multichip module Thin film The reason for the study and the logic issue of the chosen concept for building multilayer high‐speed MCM structures, based...

... of the laser trimming, inapplicable for heat‐dissipating MCM carriers. Aluminium Interconnection Multichip module Vacuum deposition Vias The utilization of metal substrates as a base of electron device package or MCM carrier is known with certain advantages[ 1 ]. When reaching a proper...

... multilayer with a sufficient smooth and planar surface suitable for thin‐film processes. © MCB UP Limited 1998 Multichip module Planarisation Polyimide Thick film Thin‐film processing Thick‐ and thin‐film technology are well established but quite different techniques...

...A. Lefeuvre; M. Caplot; C. Stranieri; P. Massiot Packages for multichip modules in military airborne applications must hava some fundamental characteristics: high thermal conductivity, low density, good mechanical properties and a coefficient of thermal expansion nearly equal...

... that incorporates knowledge of finite element analysis and multichip modules in a form that can be integrated into the design process. 4 The software architecture used for IMCMA is based on the blackboard problem‐solving paradigm developed by the artificial intelligence community. A blackboard system...