.... © MCB UP Limited 2002 Plastic ball grid array Interconnection The key to good characterisation is accuracy of measurement. In a case such as package characterisation, where probing the package directly is not easy, it is necessary to devise a good measurement methodology. Our...

...Kang Zhang; Michael Pecht Plastic ball grid array (PBGA) packages are non‐hermetic surface mount packages, designed in response to market demands for cost‐effective, high I/O count, small footprint, and low profile components. Because of the materials and construction, PBGA packages can...

... power and bond force appeared to be the most important control factor for wire pulls and ball shear force optimisation. The results show that bonding at low temperature is viable with the use of high frequency transducer wire bonder. © MCB UP Limited 1999 Plastic ball grid array Packaging...

...John Lau; Tony Chen The effect of heat‐spreader sizes on the temperature distribution, thermal resistance, and cooling power of a set of cost‐effective cavity‐down plastic ball grid array (PBGA) packages assembled on an FR‐4 epoxy glass printed circuit board (PCB) is presented. The sizes...

...John H. Lau; K.L. Chen; F. Wu NuBGA is a low‐cost, single‐core, two‐metal layer, cavity‐down plastic ball grid array package. With special design concepts, NuBGA provides electrical and thermal enhancements for electronic packaging applications. The concepts of these innovative designs are briefly...

...L. Anderson; A.A. Primavera As plastic ball grid array(PBGA) components proliferate, card assembly questions arise about the robustness of the module to card attachment process. A designed experiment was performed to measure the sensitivity of card assembly yields to normal assembly process...

...P. McCluskey; R. Munamarty; M. Pecht Plastic ball grid arrays (PBGAs) have been gaining increasing industry acceptance as potentially the lowest cost packages for high pin count applications. The main factors for their success include the inherent low cost of plastic packages, the high yields...

...G. Hill Plastic ball grid arrays (PBGAs) have begun to gain popularity in the electronic packaging market because of their advantages over peripheral leaded devices. In addition to good electrical performance, the PBGAs offer advantages to the assembler. The development of a successful assembly...