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Journal Articles
Microelectronics International (2019) 36 (2): 83–87.
Published: 21 May 2019
...Piotr Kowalik; Edyta Wrobel; Janusz Mazurkiewicz Purpose The purpose of this paper is to present the possibility of technology of chemical metallization for the production of electrodes and resistors based on Ni–P alloy on silicon (Si), alundum (Al2O3) and low temperature...
Journal Articles
Microelectronics International (2009) 26 (3): 30–34.
Published: 31 July 2009
... as a sensor in this work belongs to cell based planar resistor configurations (Figure 1) with a nominal resistance round 5.6 kΩ at room temperature. The slope of NTC behavior is gentle and the determined exponential factor B=4,095 is suitable for temperature measurements. TFSTs can be mass‐produced...
Journal Articles
Microelectronics International (2009) 26 (2): 24–27.
Published: 08 May 2009
...Z. Pruszowski; P. Kowalik; M. Cież; J. Kulawik Purpose The purpose of this paper is to characterize electrical parameters of amorphous Ni‐P resistive layers used for fabrication of precise resistors. Design/methodology/approach Ni‐P resistive layers were produced by the chemical process...
Journal Articles
Microelectronics International (2008) 25 (3): 33–36.
Published: 25 July 2008
...Y. Srinivasa Rao Purpose The purpose of this paper is to study the variation of the temperature coefficient of resistance (TCR) of polymer thick film resistors, namely, PVC‐graphite thick film resistors, with parameters such as volume fraction, grain size, and high voltage. Design/methodology...
Journal Articles
Microelectronics International (2005) 22 (1): 26–33.
Published: 01 April 2005
... μm2). Design/methodology/approach The geometrical parameters (average length, width and thickness, relations between designed and real dimensions, distribution of planar dimensions) are correlated with basic electrical properties of resistors (sheet resistance and its distribution, hot temperature...
Journal Articles
Microelectronics International (2004) 21 (1): 28–30.
Published: 01 April 2004
...Maqsood A. Chaudhry Finite difference method (FDM) is a very useful and simple tool in determining electrical potential field of two‐dimensional geometries, such as integrated circuit (IC) planar resistors. It is very accurate and its accuracy can be easily controlled by changing the grid size. One...
Journal Articles
Microelectronics International (2003) 20 (3): 7–10.
Published: 01 December 2003
...Y. Srinivasa Rao; M. Satyam This paper deals with the investigations carried out on the variation of current noise (1/f noise) in polymer thick film resistors, when they are subjected to pulse voltage trimming. The current noise is measured in terms of noise index (micro volts of noise per...
Journal Articles
Microelectronics International (2003) 20 (2): 10–15.
Published: 01 August 2003
...Y. Srinivasa Rao; M. Satyam The effect of high voltage pulses on the resistance of polymer thick film resistors (PTFR) is studied. It is found that the resistance decreases with both the amplitude and duration of the high voltage pulses and with the number of pulses. The change in resistance...
Journal Articles
Microelectronics International (2003) 20 (2): 41–45.
Published: 01 August 2003
...Darko Belavic; Marko Hrovat; Marina Santo Zarnik; Andreja Bencan; Walter Smetana; Roland Reicher; Heinz Homolka Strain gauges can be realised by printing and firing thick‐film resistors on ceramic substrates that are usually based on alumina. However, sensing elements made on some other substrates...
Journal Articles
Journal Articles
Microelectronics International (2001) 18 (1)
Published: 01 April 2001
... © MCB UP Limited 2001 --> CAMD Resistors Chip scale packaging Precision thin film resistors now available in chip scale format Keywords: CAMD, Resistors, Chip scale packaging California Micro Devices Corporation (CAMD) has announced the availability of FCRN303...
Journal Articles
Microelectronics International (2000) 17 (2): 7–10.
Published: 01 August 2000
...D.M. Stubbs; S.H. Pulko; A.J. Wilkinson; B. Wilson; F. Christiaens; K. Allaert The embedding of passive components such as resistors, capacitors and inductors within printed circuit boards (PCBs) is motivated, to a large extent, by the desire for increased miniaturisation of electronic goods...
Journal Articles
Microelectronics International (2000) 17 (2)
Published: 01 August 2000
... © MCB UP Limited 2000 --> Mini-Systems Thin film Resistors Keywords Mini-Systems, Thin film, Resistors The Thin Film Division of Mini-Systems, Inc. has announced that their MIL-PRF-55342 resistors now qualify for Life Failure Rate R. This designation indicates...
Journal Articles
Microelectronics International (1999) 16 (1)
Published: 01 April 1999
... © MCB UP Limited 1999 --> MMC Resistors New resistor networks protect AMD telecom chip sets against transient power faults under bellcore/ITU specs Keywords MMC, Resistors New thick-film line feed resistors, the B11 and B21 modules from Microelectronic Modules...
Journal Articles
Microelectronics International (1997) 14 (2): 65–66.
Published: 01 August 1997
...D. Jean; R. Linde Polymer thick film (PTF) resistors have been effectively used for many years in consumer goods like timers, motor controls, computers and a wide variety of high performance equipment. The potential for this technology has reached only a small portion of the market; its full...
Journal Articles
Microelectronics International (1997) 14 (2): 22–24 (continued on pages 57,58).
Published: 01 August 1997
...M.F. Barker The growth in digital telecom systems around the world has led to an increase in demand for surge protection components. These components often use low ohm resistor compositions in a serpentine configuration. The demands placed upon these materials during pulsing are high. Not only...
Journal Articles
Microelectronics International (1996) 13 (2): 17–21.
Published: 01 August 1996
...Maqsood A. Chaudhry The problem of determining the optimal location and length of a slit to obtain a desired value of resistance in polygonal integrated circuit thin‐film resistors prior to laser trimming them has applications in IC fabrication technology. The optimal location of the slit can...

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