Low cycle fatigue tests on as‐cast Sn–Ag eutectic solder (96.5Sn–3.5Ag) were carried out using a non‐contact strain controlled system at 20°C with different frequencies (10−3–1 Hz). Steps at the boundaries of Sn‐dendrites were found to be the initiation sites for microcracks in the case of low frequency fatigue tests, while for high frequency tests, cracks predominantly initiated at the boundaries of subgrains formed within Sn‐dendrites. The link up of these cracks and the propagation of cracks inside the specimen occurred both transgranularly through Sn–Ag eutectic phases, and intergranularly along Sn‐dendrite boundaries and/or subgrain boundaries. Propagation of stage II cracks for various frequencies could be characterized by the C*‐parameter.
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December 01 2002
Low cycle fatigue and fatigue crack growth behaviour of Sn–Ag eutectic solder
C. Kanchanomai;
C. Kanchanomai
Department of Mechanical Engineering, Nagaoka University of Technology, Nagaoka, Japan Present address: Department of Mechanical Engineering, Thammasat University (Rangsit Campus), Thailand
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Y. Miyashita;
Y. Miyashita
Department of Mechanical Engineering, Nagaoka University of Technology, Nagaoka, Japan
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Y. Mutoh;
Y. Mutoh
Department of Mechanical Engineering, Nagaoka University of Technology, Nagaoka, Japan
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S.L. Mannan
S.L. Mannan
Indira Gandhi Centre for Atomic Research, Tamil Nadu, India
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Publisher: Emerald Publishing
Online ISSN: 1758-6836
Print ISSN: 0954-0911
© MCB UP Limited
2002
Soldering & Surface Mount Technology (2002) 14 (3): 30–36.
Citation
Kanchanomai C, Miyashita Y, Mutoh Y, Mannan S (2002), "Low cycle fatigue and fatigue crack growth behaviour of Sn–Ag eutectic solder". Soldering & Surface Mount Technology, Vol. 14 No. 3 pp. 30–36, doi: https://doi.org/10.1108/09540910210444700
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