Issues

Special Issue: Lead free and lead bearing solders. Guest Editors: John H.L. Pang, Stephen C.K. Wong, Z.P. Wang

Association news

The SMART Group launches free participation in PPM monitoring project

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IPC. SMEMA Council's APEX® 2003 welcomes new volunteers

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IPC's new document to facilitate purchasing process

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IPC. Inaugural IPC/JEDEC conference helps get the lead out

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SMTA

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IPC. Report first dip in EMS industry sales since 1985

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Book reviews

Dry Film Photoresist Processing Technology

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Printed Circuit Board Manufacture 5th Edition

Clyde F. Coombs Jr
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Reactions between Sn–Ag–Cu lead‐free solders and the Au/Ni surface finish in advanced electronic packages

L.C. Shiau; C.E. Ho; C.R. Kao
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Lead‐free solder process implementation for PCB assembly

Peter Collier; Vasudivan Sunappan; Arulvanan Periannan
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Assessment of board level solder joint reliability for PBGA assemblies with lead‐free solders

Shi‐Wei Ricky Lee; Ben Hoi Wai Lui; Y.H. Kong; Bernard Baylon; Timothy Leung; Pompeo Umali; Hector Agtarap
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Evaluation of two novel lead‐free surface finishes

Richard Ludwig; Ning‐Cheng Lee; Chonglun Fan; Yun Zhang
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Low cycle fatigue and fatigue crack growth behaviour of Sn–Ag eutectic solder

C. Kanchanomai; Y. Miyashita; Y. Mutoh; S.L. Mannan
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Fatigue crack growth behaviour of lead‐containing and lead‐free solders

Y. Mutoh; J. Zhao; Y. Miyashita; C. Kanchanomai
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Predictive reliability models through validated correlation between power cycling and thermal cycling accelerated life tests

P. Towashiraporn; G. Subbarayan; B. McIlvanie; B.C. Hunter; D. Love; B. Sullivan
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Editorial

Special Issue on lead-free and lead-bearing solders

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Industry news

Revolutionary circuit technology takes top award

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European expansion for L.E.W. Techniques

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Asymtek contributes advanced semiconductor applications technology to KAIST University

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Strategic acquisition by DEK builds process support products infrastructure in the America and Asia

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Data I/O celebrates 30 years in device programming

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Redring Solder appoints Sogem as its distributor for Europe and Africa

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SMT Nuremberg releases visitor report

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JOT Automation and Elektrobit have combined businesses

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International diary

International diary

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Internet commentary

Internet commentary

Brian Ellis
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Literati Club

Awards for Excellence

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New products

New AOI-system to inspect solder paste in 2-D

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New pick and place range introduced by MDC

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SP200avi inline stencil printer

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Flo-Master III SMD-5003 rework system handles largest PCBs, offers powerful bottom-side heating

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Lead free soldering

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Non-refrigerated no-clean solder paste

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IPC-9261, in process DPMO and estimated yield for PWA's

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Orbotech introduces cost-effective AOI series for electronics assembly

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JNJ Industries' RFS-25 closes the loop for ultrasonic batch cleaners; eliminates wastewater discharge

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X-Tek launches advanced new Orbita x-ray system

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Cookson launches broad latitude, lead free SMT solder paste

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SWAX cleans up

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Asymtek receives patents for co-axial air dispensing technique

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Instant fixture system for DEKprinters

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Complete solution for the reflow industry

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Note from the publisher

Note from the publisher

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Publications

Announcement of a new research report by JMS

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