New high speed surface mount adhesive for difficult to bond applications

New high speed surface mount adhesive for difficult to bond applications

Keywords Loctite, Adhesives

Loctite Corporation has introduced new Loctite 3615, a surface mount adhesive designed for high speed dispensing onto difficult to bond substrates such as ceramics and certain solder mask materials (Plate 8).

 Plate 8Loctite 3615

Loctite 3615 is a single-component epoxy adhesive designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. The new product is moisture tolerant and formulated for high adhesion to low stress molding compounds. Loctite 3615 is well suited for high speed dispense in positive displacement and pressure-time dispense systems, offering a good dot profile and good on-board electrical characteristics. The adhesive cures completely in just 60 to 90 seconds at 150°C, or in three to five minutes at 125°C.

Further information: http://www.loctite.com