1st European Union/United States Lead-Free Solder Interface Meeting
Keywords: Lead-free solder, Meetings
The first EU/US interface meeting on lead-free technology was held at the American Embassy, 24 Grosvenor Square, London, UK, March 27th, 2002.
Aim of Meeting
The aim of the meeting, which was principally a US initiative, promoted by U.S. aerospace companies & organisations, was to seek a lead- free working partnership with EU companies & organisations, under JG-PP, the Joint Group on Pollution Prevention, which includes US Dept of Defence and NASA.
Speakers & papers presented, photo from left to right:
Richard E. Pinckert, Director of Design Integration & Environmental Assurance The Boeing Company, USA.Boeing's Lead-Free Solder Efforts
GEN Pelagio Castelo Branco, PresidentAssociacao Danotec, Portugal.A European Defence Industry Perspective
Barry M. Braden, Deputy Associate Director, Spaceport Technology PMO, NASA,National Aeronautics and Space Administration, USA.Exchange on EU-US efforts in lead-free solder technology, Identify partnerships
Lee Whiteman, Senior Manufacturing Engineer & Principal Investigator American Competitiveness Institute, USA.Initiative in Lead-Free Solder,Manufacturing & Industry Feedback
Robert P. Hill, Vice President & COO ITB. Inc, USA & NASA Program IntegratorOverview of Joint Group on Pollution Prevention Program &Project Methodology
Ruben Bergman, Executive Director HDP, High Density Packaging, User Group,USA & Chairman, Global Environmental Coordination Initiative.General Purpose Lead-Free Assembly, The HDP User Group & GECI views
Clive Simmonds, Manufacturing Engineering Manager BAE Systems, UK.Lead-Free Solder, Manufacturing Experience & Industry Feedback
Kay Nimmo, Director, Research and DevelopmentSoldertec at Tin Technology.Lead-Free in Europe: Legislation, Technology Roadmap &Research
Dr F. Michael Pestorius, Technical Director, U.S Office of Naval Research,International Field Office, based in U.K.Welcome & overview
Norman R Stockham, Business Development manager, Electronics & Sensors,TWI Ltd, U.K.TWI's Experience of Lead-Free Soldering, Issues & Non Solder Options
Rick CiocciCALCE, Electronics Product and Systems Centre.US Research Institution Roadmap for the Migration to Lead-Free Electronics
Eduardo Manual Dias Lopes, Director,Instituto De Sodara E Qualidade,Portugal.ISQ's Experience with Lead-Free Solder
At the conclusion to the day, Robert P Hill requested that any attendees interested in joining this JG-PP Initiative should respond within three weeks.
