Huntsman advanced materials introduces silver-filled epoxy die attach adhesive Free

Huntsman advanced materials introduces silver-filled epoxy die attach adhesive

A one-component, silver-filled epoxy adhesive that combines high electrical and thermal conductivity with good bond strength has been introduced by Huntsman Advanced Materials.

Araldite^w 7047 epoxy adhesive is a high purity, 100 percent solids system designed for void-free bonding of circuitry and microelectronic chips to printed circuit boards. It has an extended work life of up to four days at room temperature and cures quickly in 1 h at 1658C (3298F). It is high-speed dispensable and stable at room temperature for extended periods.

Araldite^w 7047 silver-filled epoxy is formulated without solvents or viscosity diluents to reduce potential outgassing. With its high-temperature performance, Araldite^w 7047 is compatible with lead- free processing.

Once cured, it exhibits an aluminium/ aluminium lap shear strength of 1,300 psi (8MPa) and gold/gold die shear of 1,700 psi (11MPa) at room temperature.

Volume resistivity at room temperature is ,0.0002V cm, even after 1,000 h aging. The epoxy has a glass transition temperature of 1308C (2668F) and coefficient of thermal expansion of 72ppm/8C.

For further information, please visit web site: www.huntsman.com/electronics.