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Issue
13 February - Volume 19, Issue 1, Pages 4 - 44
17 April - Volume 19, Issue 2, Pages 4 - 38
3 July - Volume 19, Issue 3, Pages 3 - 33
25 September - Volume 19, Issue 4, Pages 3 - 32
Volume 19, Issue 2
17 April 2007
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ISSN
0954-0911
EISSN
1758-6836
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In this Issue
Appointments
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Appointments
Exerra names Ian Fleck as General Manager
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Global environmental impact assessment of the Pb‐free shift
Anders S.G. Andrae
;
Norihiro Itsubo
;
Atsushi Inaba
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Strain range fatigue life assessment of lead‐free solder interconnects subject to temperature cycle loading
Michael Osterman
;
Michael Pecht
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High‐cycle fatigue testing of Pb‐free solder joints
N. Barry
;
I.P. Jones
;
T. Hirst
;
I.M. Fox
;
J. Robins
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Dissolution of copper on Sn‐Ag‐Cu system lead free solder
Goro Izuta
;
Tsuyoshi Tanabe
;
Katsuaki Suganuma
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Editorial
Editorial
Martin Goosey
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Features
Unique resource puts region's electronics industry on the global map
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The Innovative Electronics Manufacturing Research Centre
Dr Darren Cadman
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Industry news
Assembléon wins Frost & Sullivan's 2006 Customer Value Enhancement Award
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Growing demand for UK-based electromechanical sub-assembly confirmed by launch of new manufacturing group
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Della Systems receives IPC Certification for Lead Free Electronics Assembly Process Capability
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Exception predicts big growth in “micro-miniature”
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New products
MYDATA introduces the Agilis Stick Magazine
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Assembléon's Installed Base Solutions provide value-added services to ensure lines stay competitive
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Huntsman advanced materials introduces silver-filled epoxy die attach adhesive
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Lightning Packaging announce launch of biodegradable and compostable air pillows
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Assembléon provides flexibility and performance with the A-Series and Installed Base Solutions
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New UV/visible adhesive technology provides aggressive bonds to PET and R-PET plastics
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Universal extends flagship platform portfolio
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Valor announces vPlan – breakthrough in assembly process engineering
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New Kit and Kaboodle from Intertronics
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Lead-free just got more economical
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Award-winning Speedline dispensing from Contax
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Latest
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Nanocopper-based low-temperature interconnection technology: advances in material systems, sintering mechanisms and packaging applications
L-shaped epoxy reinforcement optimization for vibration reliability of microspring array pins in aerospace large-scale integrated circuits
Study on process optimization and suppression methods for wafer-level electroplated copper nodule defects
Simulation and structural optimization of key structural mechanical properties of TR modules with quasi-coaxial structure under high-impact loads
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