Issues

Appointments

Exerra names Ian Fleck as General Manager

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Global environmental impact assessment of the Pb‐free shift

Anders S.G. Andrae; Norihiro Itsubo; Atsushi Inaba
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Strain range fatigue life assessment of lead‐free solder interconnects subject to temperature cycle loading

Michael Osterman; Michael Pecht
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High‐cycle fatigue testing of Pb‐free solder joints

N. Barry; I.P. Jones; T. Hirst; I.M. Fox; J. Robins
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Dissolution of copper on Sn‐Ag‐Cu system lead free solder

Goro Izuta; Tsuyoshi Tanabe; Katsuaki Suganuma
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Editorial

Editorial

Martin Goosey
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Features

Unique resource puts region's electronics industry on the global map

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The Innovative Electronics Manufacturing Research Centre

Dr Darren Cadman
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Industry news

Assembléon wins Frost & Sullivan's 2006 Customer Value Enhancement Award

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Growing demand for UK-based electromechanical sub-assembly confirmed by launch of new manufacturing group

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Della Systems receives IPC Certification for Lead Free Electronics Assembly Process Capability

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Exception predicts big growth in “micro-miniature”

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New products

MYDATA introduces the Agilis Stick Magazine

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Assembléon's Installed Base Solutions provide value-added services to ensure lines stay competitive

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Huntsman advanced materials introduces silver-filled epoxy die attach adhesive

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Lightning Packaging announce launch of biodegradable and compostable air pillows

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Assembléon provides flexibility and performance with the A-Series and Installed Base Solutions

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New UV/visible adhesive technology provides aggressive bonds to PET and R-PET plastics

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Universal extends flagship platform portfolio

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Valor announces vPlan – breakthrough in assembly process engineering

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New Kit and Kaboodle from Intertronics

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Lead-free just got more economical

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Award-winning Speedline dispensing from Contax

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