SMTA. SMTA hosts talk on packaging future
SMTA
SMTA hosts talk on packaging future
Keywords SMTA, Packaging
The Surface Mount Technology Association invites members and non-members to attend the SMTA Annual Meeting and luncheon on Tuesday, September 14, 1999, during SMTA International in San Jose, California, USA. Keynote speaker Stanley T. Myers, president of Semiconductor Equipment and Materials International (SEMI), will present "A new packaging scenario is on the horizon the need for collaboration is now!".
"The time when chip designers could let someone else worry about how the chip would be packaged is over", says Myers. "Rapid changes in packaging reveal a need for increased collaboration between chip designer and packaging engineer."
Myers will discuss the future of packaging, market size, and the industry's role in moving this new trend in packaging towards a more strategic and collaborative effort.
The SMTA International conference and exhibition, 12-16 September, focuses exclusively on surface mount, advanced packaging, and companion technologies. Find out more about this premier industry event by calling (toll free) 877-232-8845, or visit www.smta-international.com
