Loctite multicore introduces anti-tombstoning solder pastes formulated with 63S4 alloy

Loctite Multicore has introduced new family of solder paste products formulated with the unique 63S4 alloy that eliminates costly tombstone defects and reduces component misalignment that occurs when reflowing boards with very small components.

Multicore® 63S4 solder pastes produce safe residues and are effective over a wide range of reflow profiles in air or nitrogen. Suitable for fine pitch printing to 0.4mm and high speed stencil printing up to 150mm/sec these products contain a high activity no-clean flux that is highly effective on difficult to solder substrates such as HASL, OSP copper, gold over nickel, and silver immersion. All three 63S4 products offer excellent abandon time, long open time,exceptional slump resistance, and superior tack life.

For more information visit: www.loctite.com