Issues

Special Issue: Computational modelling technology. Guest Editor: Chris Bailey

Appointments

A new CEO for Instem Technologies

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New man at the helm for X-Tek

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Tecnomatix-Unicam expands executive team

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Association News

SMTA.Pan pacific microelectronics symposium preliminary program announced

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SMTA.Third technology symposium to be held at SMTA Boston 2002

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Book review

Environment-friendly Electronics: Lead-free Technology

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Correlation of solder paste rheology with computational simulations of the stencil printing process

R. Durairaj; G.J. Jackson; N.N. Ekere; G. Glinski; C. Bailey
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CFD modelling of the flow field inside a reflow oven

Hao Yu; Jorma Kivilathti
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Numerical modelling of scanned beam laser soldering of fine pitch packages

P.M. Beckett; A.R. Fleming; J.M. Gilbert; D.G. Whitehead
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Solder paste reflow modeling

S.H. Mannan
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Analysis on solder ball shear testing conditions with a simple computational model

S.W. Ricky Lee; Xingjia Huang
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Optimisation modelling for flip‐chip solder joint reliability

S. Stoyanov; C. Bailey; M. Cross
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A simplified model of the reflow soldering process

David C. Whalley; Stuart M. Hyslop
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Editorial

Editorial

Chris Bailey
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Industry news

A range of new chemicals

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New alliance in the SMT arena

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Oxford Instruments Analytical extends product range to include coating measurement instruments

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ems – ALLIANCE the new concept for electronics manufacturing

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The National Physical Laboratory celebrates the strength of UK measurement through national awards

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International diary

International diary

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Internet commentary

Internet commentary

Brian Ellis
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New products

High-performance stencils for vector™ and tetra™ frames

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Selective soldering system from Vitronics Soltec

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EKRA announces the release of the E5-36 large format in-line sten

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Loctite multicore introduces anti-tombstoning solder pastes formulated with 63S4 alloy

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New electronics coating lowers cost of moisture protection for PCBs

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Multicore solders introduces new lead-free no-clean solder cream for SMT assembly

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New thin bondline, thermal interface material

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IC-SCAN DE tracks MSDs for double side reflow boards

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Pyramax lowers cost of ownership

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New printers from Reprint

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Dexter introduces 260°C reflow silver-filled conductive adhesive

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New convertible head flip chip bonder

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Focus is on the Hawk

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Test jig boosts productivity for users of surface-mount feeders

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Publications

New standard published in the BS-7000 series

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IPC-VT-42/43 hand soldering for through-hole components

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SMART Group

Fifth SMART group european conference 2002announced

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The SMART group environmental electronics seminar

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