Issues

Special Issue: Advanced manufacturing processes, lead free interconnect materials and reliability modelling for electronics packaging. Guest Editors: Christopher Bailey, Johan Liu

Appointments

New strategic manager for leading EMS cooperation

View articletitled, New strategic manager for leading EMS cooperation
Add to Citation Manager for New strategic manager for leading EMS cooperation

Projects manager appointed by Jaltek

View articletitled, Projects manager appointed by Jaltek
Add to Citation Manager for Projects manager appointed by Jaltek

Universal Instruments appoints new director for Europe

View articletitled, Universal Instruments appoints new director for Europe
Add to Citation Manager for Universal Instruments appoints new director for Europe

Universal Instruments boosts Genesis Platform Team with new appointments

View articletitled, Universal Instruments boosts Genesis Platform Team with new appointments
Add to Citation Manager for Universal Instruments boosts Genesis Platform Team with new appointments

Book Review

Lead‐Free Solder Interconnection Reliability

Bob Willis
View articletitled, Lead‐Free Solder Interconnection Reliability
Add to Citation Manager for Lead‐Free Solder Interconnection Reliability

Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy‐based binder

Masahiro Inoue; Katsuaki Suganuma
View articletitled, Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy‐based binder
Open the PDF for Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy‐based binder in another window
Add to Citation Manager for Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy‐based binder

High performance anisotropic conductive adhesives for lead‐free interconnects

Yi Li; C.P. Wong
View articletitled, High performance anisotropic conductive adhesives for lead‐free interconnects
Open the PDF for High performance anisotropic conductive adhesives for lead‐free interconnects in another window
Add to Citation Manager for High performance anisotropic conductive adhesives for lead‐free interconnects

High strain rate testing of solder interconnections

K.T. Tsai; F‐L. Liu; E.H. Wong; R. Rajoo
View articletitled, High strain rate testing of solder interconnections
Open the PDF for High strain rate testing of solder interconnections in another window
Add to Citation Manager for High strain rate testing of solder interconnections

Macro‐micro modelling of moisture induced stresses in an ACF flip chip assembly

C.Y. Yin; H. Lu; C. Bailey; Y.C. Chan
View articletitled, Macro‐micro modelling of moisture induced stresses in an ACF flip chip assembly
Open the PDF for Macro‐micro modelling of moisture induced stresses in an ACF flip chip assembly in another window
Add to Citation Manager for Macro‐micro modelling of moisture induced stresses in an ACF flip chip assembly

Finite element analysis of fleXBGA reliability

Gang Chen; Xu Chen
View articletitled, Finite element analysis of fleXBGA reliability
Open the PDF for Finite element analysis of fleXBGA reliability in another window
Add to Citation Manager for Finite element analysis of fleXBGA reliability

Coffin‐Manson constant determination for a Sn‐8Zn‐3Bi lead‐free solder joint

Peng Sun; Cristina Andersson; Xicheng Wei; Zhaonian Cheng; Dongkai Shangguan; Johan Liu
View articletitled, Coffin‐Manson constant determination for a Sn‐8Zn‐3Bi lead‐free solder joint
Open the PDF for Coffin‐Manson constant determination for a Sn‐8Zn‐3Bi lead‐free solder joint in another window
Add to Citation Manager for Coffin‐Manson constant determination for a Sn‐8Zn‐3Bi lead‐free solder joint

Intermetallic compound formation and diffusion path evolution in eutectic tin‐lead flip chip solder bumps after aging

Li‐Yin Hsiao; Jenq‐Gong Duh
View articletitled, Intermetallic compound formation and diffusion path evolution in eutectic tin‐lead flip chip solder bumps after aging
Open the PDF for Intermetallic compound formation and diffusion path evolution in eutectic tin‐lead flip chip solder bumps after aging in another window
Add to Citation Manager for Intermetallic compound formation and diffusion path evolution in eutectic tin‐lead flip chip solder bumps after aging

Exhibitions and conferences

The Smart Group 8th Annual Leadfree Seminar – February 16, 2006

View articletitled, The Smart Group 8th Annual Leadfree Seminar – February 16, 2006
Add to Citation Manager for The Smart Group 8th Annual Leadfree Seminar – February 16, 2006

EIPC Winter Conference 2006, January 26 and 27, Budapest, Hungary

View articletitled, EIPC Winter Conference 2006, January 26 and 27, Budapest, Hungary
Add to Citation Manager for EIPC Winter Conference 2006, January 26 and 27, Budapest, Hungary

Guest editorial

Guest editorial

Chris Bailey; Johan Liu
View articletitled, Guest editorial
Add to Citation Manager for Guest editorial

Industry news

Contax installs new SMT line for Chemigraphic

View articletitled, Contax installs new SMT line for Chemigraphic
Add to Citation Manager for Contax installs new SMT line for Chemigraphic

Soldertec Global announces winners of lead free solder awards 2005

View articletitled, Soldertec Global announces winners of lead free solder awards 2005
Add to Citation Manager for Soldertec Global announces winners of lead free solder awards 2005

DEK sweeps industry awards mass imaging leader takes top honors in three prestigious contests

View articletitled, DEK sweeps industry awards mass imaging leader takes top honors in three prestigious contests
Add to Citation Manager for DEK sweeps industry awards mass imaging leader takes top honors in three prestigious contests

IPC SPVC announces research paper on solder joint voids for lead free solder

View articletitled, IPC SPVC announces research paper on solder joint voids for lead free solder
Add to Citation Manager for IPC SPVC announces research paper on solder joint voids for lead free solder

Siemens wins Global Technology Award

View articletitled, Siemens wins Global Technology Award
Add to Citation Manager for Siemens wins Global Technology Award

Changes at Multiline and mie

View articletitled, Changes at Multiline and mie
Add to Citation Manager for Changes at Multiline and mie

Norcott EMS and Miranda Technologies conclude successful lead free PCB trials

View articletitled, Norcott EMS and Miranda Technologies conclude successful lead free PCB trials
Add to Citation Manager for Norcott EMS and Miranda Technologies conclude successful lead free PCB trials

International diary

International diary

View articletitled, International diary
Add to Citation Manager for International diary

Internet commentary

And, in the last analysis, he is on the side of those with plenty of money

Brian Ellis
View articletitled, And, in the last analysis, he is on the side of those with plenty of money
Add to Citation Manager for And, in the last analysis, he is on the side of those with plenty of money

New products

Solbraze solder pots sweep dross away for perfect tinning

View articletitled, Solbraze solder pots sweep dross away for perfect tinning
Add to Citation Manager for Solbraze solder pots sweep dross away for perfect tinning

Power spray cleaning from Contax

View articletitled, Power spray cleaning from Contax
Add to Citation Manager for Power spray cleaning from Contax