Issues

Book review

Electronic Circuits, Fundamentals and Applications, 3rd edition

Brian Ellis
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Laser soldering control using optical imaging

James M. Gilbert; Zaif Dabestani
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Reliability of ACA bonded flip chip joints on LCP and PI substrates

Laura Frisk; Anne Cumini
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The effects of chip and substrate thickness on the reliability of ACA bonded flip chip joints

Laura Frisk; Kati Kokko
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The effect of reflow profile on SnPb and SnAgCu solder joint shear strength

Jianbiao Pan; Brian J. Toleno; Tzu‐Chien Chou; Wesley J. Dee
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Failure analysis techniques for lead‐free solder joints

Todd Castello; Dan Rooney; Dongkai Shangguan
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Determining conformal coating protection

Christopher Hunt; Angela Mensah; Anthony Buxton; Richard Holman
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Emerald Literati Network

Awards for Excellence

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Industry news

SMT 2006 “best ever” exhibition for Hybrid Laser Tech

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Universal Instruments leaves Dover portfolio

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Siemens acquires Opto-Control, a specialist for 3D automatic optical inspection systems

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SENSOR Conference 2007 Call for Papers

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Universal Instruments and Tsinghua University sign co-operation agreement

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New products

Universal Instruments enhances package-on-package flexibility

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Cordless, drip-free two pack dispenser makes it “light & easy”

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Laird technologies now offer a range of high-performance thermally conductive gap fillers to counter electronics heat transfer problems

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ATF wave soldering systems from Contax

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DEK develops solution for high throughput singulated substrate processing

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Showcasing JTAG ProVision™ at ESS

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New tools from DEK enable 25 micron backside wafer coating at high-speed

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Unrivalled customer support gets the green light with DEK's ISCAN health check

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New clarity in adhesion from Opti-tec™ at Intertronics

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OK International announces four new soldering/desoldering equipment packages

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