Issues

Appointments

Michael Brianda appointed as DEK President

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HumiSeal strengthens European R&D team with senior appointment

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Effect of Ag content on the microstructure of Sn‐Ag‐Cu based solder alloys

M. Reid; J. Punch; M. Collins; C. Ryan
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Hydrocarbon fluxes for ionic compound free soldering: improvement by peroxide additives

Toshihiro Miyake; Masaru Ishida; Satoshi Inagaki
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Workmanship standards and their application on ESA projects

Barrie D. Dunn
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Evaluation of the influence of Bi and Sb additions to Sn‐Ag‐Cu and Sn‐Zn alloys on their surface tension and wetting properties using analysis of variance – ANOVA

K. Bukat; J. Sitek; R. Kisiel; Z. Moser; W. Gasior; M. Kościelski; J. Pstruś
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Thermal profiling: a reflow process based on the heating factor

Jin Gang Gao; Yi Ping Wu; Han Ding; Nian Hong Wan
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Exhibitions and conferences

A review EIPC summer conference, Dresden, May 29-30, 2008

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IEMRC 3rd annual conference, 4 July, Loughborough UK

Pete Starkey
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Industry news

Mara Technologies expands operations with new assembléon pick and place machines

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New strategy for printed electronics

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Optomec and Applied Nanotech Holdings, Inc. announce strategic cooperation to introduce optimized copper inks for aerosol jet printing for printable electronics

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iNEMI schedules sustainability summit to plan strategic action on environmental issues

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Embossing tools for high-resolution manufacturing

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Cookson move manufacture to Hungary

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International diary

International diary

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New products

DEK releases a sweeping range of innovative product functionality improvements

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DEK announces precision screens for PV cell production

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