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Journal Articles

SAC 305 solder paste with carbon nanotubes – part I: investigation of the influence of the carbon nanotubes on the SAC solder paste properties

K. Bukat, J. Sitek, M. Kościelski, M. Jakubowska, M. Słoma, A. Młożniak, W. Niedźwiedź

Soldering & Surface Mount Technology (2012) 24 (4): 267–279.

https://doi.org/10.1108/09540911211262557

Published: 14 September 2012

View article titled, SAC 305 solder paste with carbon nanotubes – part I: investigation of the influence of the carbon nanotubes on the SAC solder paste properties

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Journal Articles

Silver nanoparticles effect on the wettability of Sn‐Ag‐Cu solder pastes and solder joints microstructure on copper

K. Bukat, M. Kościelski, J. Sitek, M. Jakubowska, A. Młożniak

Soldering & Surface Mount Technology (2011) 23 (3): 150–160.

https://doi.org/10.1108/09540911111146908

Published: 28 June 2011

View article titled, Silver nanoparticles effect on the wettability of Sn‐Ag‐Cu solder pastes and solder joints microstructure on copper

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Journal Articles

Investigation of the effect of indium addition on wettability of Sn‐Ag‐Cu solders

Z. Moser, P. Fima, K. Bukat, J. Sitek, J. Pstruś, W. Gąsior, M. Kościelski, T. Gancarz

Soldering & Surface Mount Technology (2011) 23 (1): 22–29.

https://doi.org/10.1108/09540911111099677

Published: 08 February 2011

View article titled, Investigation of the effect of indium addition on wettability of Sn‐Ag‐Cu solders

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Journal Articles

Investigation of Sn‐Zn‐Bi solders – Part II: wetting measurements on Sn‐Zn7Bi solders on copper and on PCBs with lead‐free finishes by means of the wetting balance method

K. Bukat, J. Sitek, M. Kościelski, Z. Moser, W. Gąsior, J. Pstruś

Soldering & Surface Mount Technology (2010) 22 (4): 13–19.

https://doi.org/10.1108/09540911011076844

Published: 21 September 2010

View article titled, Investigation of Sn‐Zn‐Bi solders – Part II: wetting measurements on Sn‐Zn7Bi solders on copper and on PCBs with lead‐free finishes by means of the wetting balance method

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Journal Articles

Investigation of Sn‐Zn‐Bi solders – Part I: surface tension, interfacial tension and density measurements of SnZn7Bi solders

K. Bukat, Z. Moser, J. Sitek, W. Gąsior, M. Kościelski, J. Pstruś

Soldering & Surface Mount Technology (2010) 22 (3): 10–16.

https://doi.org/10.1108/09540911011054145

Published: 29 June 2010

View article titled, Investigation of Sn‐Zn‐Bi solders – Part I: surface tension, interfacial tension and density measurements of SnZn7Bi solders

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Journal Articles

Evaluation of the influence of Bi and Sb additions to Sn‐Ag‐Cu and Sn‐Zn alloys on their surface tension and wetting properties using analysis of variance – ANOVA

K. Bukat, J. Sitek, R. Kisiel, Z. Moser, W. Gasior, M. Kościelski, J. Pstruś

Soldering & Surface Mount Technology (2008) 20 (4): 9–19.

https://doi.org/10.1108/09540910810902660

Published: 19 September 2008

View article titled, Evaluation of the influence of Bi and Sb additions to Sn‐Ag‐Cu and Sn‐Zn alloys on their surface tension and wetting properties using analysis of variance – ANOVA

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SAC 305 solder paste with carbon nanotubes – part I: investigation of the influence of the carbon nanotubes on the SAC solder paste properties

Silver nanoparticles effect on the wettability of Sn‐Ag‐Cu solder pastes and solder joints microstructure on copper

Investigation of the effect of indium addition on wettability of Sn‐Ag‐Cu solders

Investigation of Sn‐Zn‐Bi solders – Part II: wetting measurements on Sn‐Zn7Bi solders on copper and on PCBs with lead‐free finishes by means of the wetting balance method

Investigation of Sn‐Zn‐Bi solders – Part I: surface tension, interfacial tension and density measurements of SnZn7Bi solders

Evaluation of the influence of Bi and Sb additions to Sn‐Ag‐Cu and Sn‐Zn alloys on their surface tension and wetting properties using analysis of variance – ANOVA

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