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Journal Articles

SAC 305 solder paste with carbon nanotubes – part I: investigation of the influence of the carbon nanotubes on the SAC solder paste properties

K. Bukat, J. Sitek, M. Kościelski, M. Jakubowska, M. Słoma, A. Młożniak, W. Niedźwiedź
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2012) 24 (4): 267–279.
https://doi.org/10.1108/09540911211262557
Published: 14 September 2012
View article titled, SAC 305 solder paste with carbon nanotubes – part I: investigation of the influence of the carbon nanotubes on the SAC solder paste properties
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Journal Articles

Silver nanoparticles effect on the wettability of Sn‐Ag‐Cu solder pastes and solder joints microstructure on copper

K. Bukat, M. Kościelski, J. Sitek, M. Jakubowska, A. Młożniak
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2011) 23 (3): 150–160.
https://doi.org/10.1108/09540911111146908
Published: 28 June 2011
View article titled, Silver nanoparticles effect on the wettability of Sn‐Ag‐Cu solder pastes and solder joints microstructure on copper
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Journal Articles

Investigation of the effect of indium addition on wettability of Sn‐Ag‐Cu solders

Z. Moser, P. Fima, K. Bukat, J. Sitek, J. Pstruś, W. Gąsior, M. Kościelski, T. Gancarz
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2011) 23 (1): 22–29.
https://doi.org/10.1108/09540911111099677
Published: 08 February 2011
View article titled, Investigation of the effect of indium addition on wettability of Sn‐Ag‐Cu solders
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Journal Articles

Investigation of Sn‐Zn‐Bi solders – Part II: wetting measurements on Sn‐Zn7Bi solders on copper and on PCBs with lead‐free finishes by means of the wetting balance method

K. Bukat, J. Sitek, M. Kościelski, Z. Moser, W. Gąsior, J. Pstruś
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2010) 22 (4): 13–19.
https://doi.org/10.1108/09540911011076844
Published: 21 September 2010
View article titled, Investigation of Sn‐Zn‐Bi solders – Part II: wetting measurements on Sn‐Zn7Bi solders on copper and on PCBs with lead‐free finishes by means of the wetting balance method
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Journal Articles

Investigation of Sn‐Zn‐Bi solders – Part I: surface tension, interfacial tension and density measurements of SnZn7Bi solders

K. Bukat, Z. Moser, J. Sitek, W. Gąsior, M. Kościelski, J. Pstruś
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2010) 22 (3): 10–16.
https://doi.org/10.1108/09540911011054145
Published: 29 June 2010
View article titled, Investigation of Sn‐Zn‐Bi solders – Part I: surface tension, interfacial tension and density measurements of SnZn7Bi solders
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Journal Articles

Evaluation of the influence of Bi and Sb additions to Sn‐Ag‐Cu and Sn‐Zn alloys on their surface tension and wetting properties using analysis of variance – ANOVA

K. Bukat, J. Sitek, R. Kisiel, Z. Moser, W. Gasior, M. Kościelski, J. Pstruś
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2008) 20 (4): 9–19.
https://doi.org/10.1108/09540910810902660
Published: 19 September 2008
View article titled, Evaluation of the influence of Bi and Sb additions to Sn‐Ag‐Cu and Sn‐Zn alloys on their surface tension and wetting properties using analysis of variance – ANOVA
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