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Journal Articles

SAC 305 solder paste with carbon nanotubes – part I: investigation of the influence of the carbon nanotubes on the SAC solder paste properties

K. Bukat, J. Sitek, M. Kościelski, M. Jakubowska, M. Słoma, A. Młożniak, W. Niedźwiedź

Soldering & Surface Mount Technology (2012) 24 (4): 267–279.

https://doi.org/10.1108/09540911211262557

Published: 14 September 2012

View article titled, SAC 305 solder paste with carbon nanotubes – part I: investigation of the influence of the carbon nanotubes on the SAC solder paste properties

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Journal Articles

Silver nanoparticles effect on the wettability of Sn‐Ag‐Cu solder pastes and solder joints microstructure on copper

K. Bukat, M. Kościelski, J. Sitek, M. Jakubowska, A. Młożniak

Soldering & Surface Mount Technology (2011) 23 (3): 150–160.

https://doi.org/10.1108/09540911111146908

Published: 28 June 2011

View article titled, Silver nanoparticles effect on the wettability of Sn‐Ag‐Cu solder pastes and solder joints microstructure on copper

Add to Citation Manager for Silver nanoparticles effect on the wettability of Sn‐Ag‐Cu solder pastes and solder joints microstructure on copper