Issues

Book review

Nanopackaging: Nanotechnologies and Electronics Packaging

Martin Goosey
View articletitled, Nanopackaging: Nanotechnologies and Electronics Packaging
Add to Citation Manager for Nanopackaging: Nanotechnologies and Electronics Packaging

Effects of conformal coating on anisotropically conductive adhesive joints; a medical perspective

Kati Kokko; Hanna Harjunpää; Anna‐Maija Haltia; Pekka Heino; Minna Kellomäki
View articletitled, Effects of conformal coating on anisotropically conductive adhesive joints; a medical perspective
Open the PDF for in another window
Add to Citation Manager for Effects of conformal coating on anisotropically conductive adhesive joints; a medical perspective

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints

Jianbiao Pan; Tzu‐Chien Chou; Jasbir Bath; Dennis Willie; Brian J. Toleno
View articletitled, Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints
Open the PDF for in another window
Add to Citation Manager for Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints

On the factors affecting the dissolution of copper in molten lead‐free solders and development of a method to assess the soldering parameters

D. Di Maio; C.P. Hunt
View articletitled, On the factors affecting the dissolution of copper in molten lead‐free solders and development of a method to assess the soldering parameters
Open the PDF for in another window
Add to Citation Manager for On the factors affecting the dissolution of copper in molten lead‐free solders and development of a method to assess the soldering parameters

Improving high‐temperature oxidation behaviour of Sn‐Zn‐Ag‐Al‐Ga solders

T.K. Yeh; K.L. Lin; B. Salam
View articletitled, Improving high‐temperature oxidation behaviour of Sn‐Zn‐Ag‐Al‐Ga solders
Open the PDF for in another window
Add to Citation Manager for Improving high‐temperature oxidation behaviour of Sn‐Zn‐Ag‐Al‐Ga solders

Reflow profile optimization of μBGA solder joints considering reflow temperature and time coupling

Tao Bo; Yin Zhouping; Ding Han; Wu Yiping
View articletitled, Reflow profile optimization of <strong><em>μ</em></strong>BGA solder joints considering reflow temperature and time coupling
Open the PDF for in another window
Add to Citation Manager for Reflow profile optimization of <strong><em>μ</em></strong>BGA solder joints considering reflow temperature and time coupling

Measuring the effect of substrate and component finishes on the reliability of isotropic electrically conductive adhesive joints

Martin Wickham; Ling Zou; Christopher Hunt
View articletitled, Measuring the effect of substrate and component finishes on the reliability of isotropic electrically conductive adhesive joints
Open the PDF for in another window
Add to Citation Manager for Measuring the effect of substrate and component finishes on the reliability of isotropic electrically conductive adhesive joints

Local melt process of solder bumping by induction heating reflow

Hongbo Xu; Mingyu Li; Yonggao Fu; Ling Wang; Jongmyung Kim
View articletitled, Local melt process of solder bumping by induction heating reflow
Open the PDF for in another window
Add to Citation Manager for Local melt process of solder bumping by induction heating reflow

Conferences and exhibitions

EIPC Summer Conference 2009, 18-19 June 2009

Martin Goosey
View articletitled, EIPC Summer Conference 2009, 18-19 June 2009
Add to Citation Manager for EIPC Summer Conference 2009, 18-19 June 2009

SMT/Hybrid/Packaging, 5-7 May 2009, Nürnberg, Germany

John Ling
View articletitled, SMT/Hybrid/Packaging, 5-7 May 2009, Nürnberg, Germany
Add to Citation Manager for SMT/Hybrid/Packaging, 5-7 May 2009, Nürnberg, Germany

Printed Electronics Europe, 7-8 April 2009, Dresden, Germany

John Ling
View articletitled, Printed Electronics Europe, 7-8 April 2009, Dresden, Germany
Add to Citation Manager for Printed Electronics Europe, 7-8 April 2009, Dresden, Germany

Lead-Free Solders and Emerging Interconnect and Packaging Technologies at the 138th TMS Annual Meeting and Exhibition, 16-19 February 2009, Moscone West Convention Center, San Francisco, California, USA

Professor Fu Guo
View articletitled, Lead-Free Solders and Emerging Interconnect and Packaging Technologies at the 138th TMS Annual Meeting and Exhibition, 16-19 February 2009, Moscone West Convention Center, San Francisco, California, USA
Add to Citation Manager for Lead-Free Solders and Emerging Interconnect and Packaging Technologies at the 138th TMS Annual Meeting and Exhibition, 16-19 February 2009, Moscone West Convention Center, San Francisco, California, USA

Editorial

Editorial

Martin Goosey
View articletitled, Editorial
Add to Citation Manager for Editorial

Industry news

OK International Soldering, Desoldering and Rework System wins again

View articletitled, OK International Soldering, Desoldering and Rework System wins again
Add to Citation Manager for OK International Soldering, Desoldering and Rework System wins again

Prodelectronic reaches an agreement with DEK to acquire the sales and manufacturing business in France

View articletitled, Prodelectronic reaches an agreement with DEK to acquire the sales and manufacturing business in France
Add to Citation Manager for Prodelectronic reaches an agreement with DEK to acquire the sales and manufacturing business in France

Rehm Thermal Systems signs distribution agreement with ENCON in Poland

View articletitled, Rehm Thermal Systems signs distribution agreement with ENCON in Poland
Add to Citation Manager for Rehm Thermal Systems signs distribution agreement with ENCON in Poland

DEK US-based stencil operations receive official ITAR registration

View articletitled, DEK US-based stencil operations receive official ITAR registration
Add to Citation Manager for DEK US-based stencil operations receive official ITAR registration

CIL expands test facility

View articletitled, CIL expands test facility
Add to Citation Manager for CIL expands test facility

SURFENERGY – a new European project to help the PCB and surface finishing sectors

View articletitled, SURFENERGY – a new European project to help the PCB and surface finishing sectors
Add to Citation Manager for SURFENERGY – a new European project to help the PCB and surface finishing sectors

Rehm Thermal Systems signs agreement with ONBoard Solutions in Australia and New Zealand

View articletitled, Rehm Thermal Systems signs agreement with ONBoard Solutions in Australia and New Zealand
Add to Citation Manager for Rehm Thermal Systems signs agreement with ONBoard Solutions in Australia and New Zealand

Alpha appoints Solder Connection

View articletitled, Alpha appoints Solder Connection
Add to Citation Manager for Alpha appoints Solder Connection

International diary

International diary

View articletitled, International diary
Add to Citation Manager for International diary

New products

Intertronics Turbo-Coat – tack free in 3 min

View articletitled, Intertronics Turbo-Coat – tack free in 3 min
Add to Citation Manager for Intertronics Turbo-Coat – tack free in 3 min

DEK launches Verification & Traceability Software Suite

View articletitled, DEK launches Verification &amp; Traceability Software Suite
Add to Citation Manager for DEK launches Verification &amp; Traceability Software Suite

Siemens Electronics Assembly Systems introduces a placement machine with rail-mounted gantries that can be added or moved within only minutes

View articletitled, Siemens Electronics Assembly Systems introduces a placement machine with rail-mounted gantries that can be added or moved within only minutes
Add to Citation Manager for Siemens Electronics Assembly Systems introduces a placement machine with rail-mounted gantries that can be added or moved within only minutes

About Sensor Products Inc. (USA)

View articletitled, About Sensor Products Inc. (USA)
Add to Citation Manager for About Sensor Products Inc. (USA)

New sensor film range maps and measures extremely low-contact pressures

View articletitled, New sensor film range maps and measures extremely low-contact pressures
Add to Citation Manager for New sensor film range maps and measures extremely low-contact pressures

Cookson Electronics launches ALPHA® WS-820 halide-free, lead-free, water soluble solder paste

View articletitled, Cookson Electronics launches ALPHA® WS-820 halide-free, lead-free, water soluble solder paste
Add to Citation Manager for Cookson Electronics launches ALPHA® WS-820 halide-free, lead-free, water soluble solder paste

Verotec extend range of 19″ modular general purpose and EMC rack cases

View articletitled, Verotec extend range of 19″ modular general purpose and EMC rack cases
Add to Citation Manager for Verotec extend range of 19″ modular general purpose and EMC rack cases