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Issue
1 February - Volume 25, Issue 1, Pages 4 - 50
5 April - Volume 25, Issue 2, Pages 68 - 127
21 June - Volume 25, Issue 3, Pages 139 - 183
13 September - Volume 25, Issue 4, Pages 195 - 250
Volume 25, Issue 3
21 June 2013
All Issues
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ISSN
0954-0911
EISSN
1758-6836
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In this Issue
Appointments
Conferences and exhibitions
Industry news
International diary
New products
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Appointments
Essemtec hires experienced specialist as demo and training manager
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ASC International hires Michael Riddle as AOI Product Manager
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Invotec Group appoints Monique Berckvens as European Sales Support and Account Manager
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The behaviour of solder pastes in stencil printing with electropolishing process
Yong‐Won Lee
;
Keun‐Soo Kim
;
Katsuaki Suganuma
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Growth behaviors of tin whisker in RE‐doped Sn‐Zn‐Ga solder
Huan Ye
;
Songbai Xue
;
Cheng Chen
;
Yang Li
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An alternative JEDEC test board design and analysis
Fang Liu
;
Guang Meng
;
Junfeng Zhao
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Filling analyses of solder paste in the stencil printing process and its application to process design
Won‐Sang Seo
;
Jong‐Bong Kim
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Comparison study of SAC405 and SAC405+0.1%Al lead free solders
Roman Koleňák
;
Robert Augustin
;
Maroš Martinkovič
;
Michal Chachula
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Conferences and exhibitions
Essential updates on RoHS and REACH; an Electronics Yorkshire (EY) Seminar
Martin Goosey
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Smart Group “Back to Basics Hands-on Rework and Inspection Workshop
Pete Starkey
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Industry news
Europlacer converts old machines to provide new solutions
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JUKI and Sony sign memorandum of intent regarding integration of SMT equipment and related businesses
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Inovar, Inc. chooses Juki again
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Etek Europe invests in Parmi HS70 Solder Paste Inspection System for UK Technology Centre
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MIRTEC Europe expands into new facility that better meets customer needs
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Computrol installs Assembléon AX-501 pick-and-place system at Utah plant
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SMART Group joins United Kingdom Electronics Alliance
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The right solution for a growing contract manufacturer
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IPC Crowns Winner of Hand Soldering World Championship
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Novel IeMRC funded Solder Flux Project Starts
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Hover-Davis announces appointment of AdoptSMT as its distributor in Austria and Switzerland
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International diary
International diary
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New products
New and improved technical specification for the Nordson DAGE XD7800 Ruby XL X-ray inspection system
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Henkel debuts high-reliability Pb-free solder alloy for high-temperature applications
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Seika Machinery picks up processing speeds with the Sayaka SAM-CT23W
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Latest
Most Read
Most Cited
AI-Driven cross-scale modeling for SiP thermo-mechanical simulation
Robust low-temperature soldering of Cu plates via a novel Ni@Cu10Ni alloy mesh reinforced SAC305 composite solder
Reliability analysis for heterogeneous millimeter-wave RF front-end package using a hybrid FEA-machine learning model
Comparative study of tensile creep behaviour of lead-free solder alloys and conventional Sn–Pb solder
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