Issues

Investigation of oxygen followed by argon plasma treatment on LED chip bond pad for wire bond application

Hui Yuen Peng; Mutharasu Devarajan; Teik Toon Lee; David Lacey
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Realistic warpage evaluation of printed board assembly during reflow process

Soonwan Chung; Jae B. Kwak
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Relative effect of solder flux chemistry on the humidity related failures in electronics

Vadimas Verdingovas; Morten Stendahl Jellesen; Rajan Ambat
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Bonding of zero-shrink LTCC with alumina ceramics

Jakub Somer; Michal Štekovič; František Urban; Josef Šandera; Ivan Szendiuch
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Recent advances in mechanical properties of anisotropic conductive adhesive film for microelectronic packaging

Lilan Gao; Hong Gao; Xu Chen
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The size effect on intermetallic microstructure evolution of critical solder joints for flip chip assemblies

Ye Tian; Justin Chow; Xi Liu; Suresh K. Sitaraman
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Thermal cycling aging effects on the ratcheting behavior of anisotropic conductive film

Hong Gao; Jianhua Ma; Lilan Gao; Dunji Yu; Jinsheng Sun
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