Issues

Special Issue: IMAPS 2017. Guest Editor: Agata Skwarek

Guest editorial

Agata Skwarek
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Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system

Balázs Illés; Agata Skwarek; Attila Géczy; László Jakab; David Bušek; Karel Dušek
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Effects of high current density on lead-free solder joints of chip-size passive SMD components

Attila Geczy; Daniel Straubinger; Andras Kovacs; Oliver Krammer; Pavel Mach; Gábor Harsányi
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The influence of a soldering manner on thermal properties of LED modules

Krzysztof Górecki; Barbara Dziurdzia; Przemyslaw Ptak
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Convection vs vapour phase reflow in LED and BGA assembly

Barbara Dziurdzia; Maciej Sobolewski; Janusz Mikolajek
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In–Bi low-temperature SLID bonding for piezoelectric materials

Knut E. Aasmundtveit; Trym Eggen; Tung Manh; Hoang-Vu Nguyen
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Characterisation of Cu/Cu bonding using self-assembled monolayer

Maria Lykova; Iuliana Panchenko; Ulrich Künzelmann; Johanna Reif; Marion Geidel; M. Jürgen Wolf; Klaus-Dieter Lang
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Investigating the attack angle of squeegees with different geometries

Oliver Krammer; László Jakab; Balazs Illes; David Bušek; Ivana Beshajová Pelikánová
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Residual free solder process for fluxless solder pastes

Alexander Hanss; Gordon Elger
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Fine line screen printed silver electrodes for copper electrodeposition

Kazimierz Drabczyk
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