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Issue
1 January - Volume 6, Issue 1, Pages 5 - 62
1 February - Volume 6, Issue 2, Pages 2 - 62
1 March - Volume 6, Issue 3, Pages 2 - 61
Volume 6, Issue 2
1 February 1994
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ISSN
0954-0911
EISSN
1758-6836
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Know‐How?
EILEEN GOOLD
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titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
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Process Modelling Maps for Solder Paste Printing
N.N. Ekere
;
E.K. Lo
;
S.H. Mannan
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titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
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Solder Replacement
H.L. Hvims
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Effect of Solder Reflow Process Variables on the Solder Wettability of Lead Free Solder Alloys
C. Melton
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for Effect of Solder Reflow Process Variables on the Solder Wettability of Lead Free Solder Alloys
Historical Failure Distribution and Significant Factors Affecting Surface Mount Solder Joint Fatigue Life
E. Nicewarner
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titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
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for Historical Failure Distribution and Significant Factors Affecting Surface Mount Solder Joint Fatigue Life
Characterising Soldering Fluxes
L.J. Turbini
;
D. Cauffield
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for Characterising Soldering Fluxes
Strengthened Solder Materials for Electronic Packaging
J.S. Hwang
;
Z. Guo
;
G. Lucey
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SMART group news
Michael Fenner
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International association news
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New Products
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Simulation and structural optimization of key structural mechanical properties of TR modules with quasi-coaxial structure under high-impact loads
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Robust low-temperature soldering of Cu plates via a novel Ni@Cu10Ni alloy mesh reinforced SAC305 composite solder
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