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1-6 of 6
Wojciech Steplewski
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Journal Articles
Stability of electrical properties for mechanically exposed thick- and thin-film resistors on flexible substrates
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (1): 54–58.
Published: 06 February 2017
Journal Articles
Influence of mechanical exposures on electrical properties of thin and thick-film flexible resistors and conductors
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2016) 28 (1): 33–38.
Published: 01 February 2016
Journal Articles
Materials and soldering challenges in lead-free Package-on-Package (PoP) technology
Available to PurchaseMarek Kościelski, Janusz Sitek, Wojciech Stęplewski, Grazyna Kozioł, Piotr Ciszewski, Tomasz Krzaczek
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2015) 27 (3): 103–107.
Published: 01 June 2015
Journal Articles
Influence of thermal cycling on reliability of solder joints executed on long and metal core PCBs
Available to PurchaseJanusz Sitek, Aneta Araźna, Kamil Janeczek, Wojciech Stęplewski, Krzysztof Lipiec, Konrad Futera, Piotr Ciszewski
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2015) 27 (3): 120–124.
Published: 01 June 2015
Journal Articles
Noise sources in polymer thick-film resistors
Available to PurchaseAdam Witold Stadler, Andrzej Kolek, Krzysztof Mleczko, Zbigniew Zawiślak, Andrzej Dziedzic, Wojciech Stęplewski
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2015) 27 (3): 115–119.
Published: 01 June 2015
Journal Articles
Influence of assembly parameters on lead-free solder joints reliability in Package-on-Package (PoP) technology
Available to PurchaseJanusz Sitek, Wojciech Stęplewski, Kamil Janeczek, Marek Kościelski, Krzysztof Lipiec, Piotr Ciszewski, Tomasz Krzaczek
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2015) 27 (3): 98–102.
Published: 01 June 2015
