... of electronic devices. The purpose of this study is to propose a finite element-artificial neural network method for the prediction of temperature and current density of solder joints, and thus provide reference information for the reliability evaluation of solder joints. Design/methodology/approach...

...Oliver Krammer; Péter Martinek; Balazs Illes; László Jakab Purpose This paper aims to investigate the self-alignment of 0603 size (1.5 × 0.75 mm) chip resistors, which were soldered by infrared or vapour phase soldering. The results were used for establishing an artificial neural network...

... not been developed yet. The paper aims to address the surface tension issue that has to be considered if the new lead free solder will be applied for electronics. Design/methodology/approach Using an artificial neural network (ANN) model with back-propagation (BP) algorithm, the surface tension for Sn...