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1-4 of 4
Keywords: Chemical elements and inorganic compounds
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Journal Articles
Investigation of the effect of indium addition on wettability of Sn‐Ag‐Cu solders
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2011) 23 (1): 22–29.
Published: 08 February 2011
... Copper Chemical elements and inorganic compounds Solders based on the Sn‐rich Sn‐Ag‐Cu alloys are widely used as substitutes for the Sn‐Pb eutectic, and a significant number of papers on their wetting properties have been published (Matsumoto and Nogi, 2008). Generally, Sn‐Ag‐Cu (SAC) alloys...
Journal Articles
Addition of cobalt nanoparticles into Sn‐3.8Ag‐0.7Cu lead‐free solder by paste mixing
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2011) 23 (1): 10–14.
Published: 08 February 2011
... hand shows the opposite trend. Pure SAC solder has the best wettability compared with the composites. © Emerald Group Publishing Limited 2011 Chemical elements and inorganic compounds Solder Melting point Hardness Solder paste Owing to worldwide environmental legislation to ban...
Journal Articles
Effects of bulk Cu6Sn5 intermetallic compounds on the properties of Sn‐Ag‐Cu‐Ce soldered joints
Available to PurchaseLiang Zhang, Song‐bai Xue, Li‐li Gao, Zhong Sheng, Wei Dai, Feng Ji, Huan Ye, Yan Chen, Sheng‐lin Yu
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2011) 23 (1): 4–9.
Published: 08 February 2011
... solders as well as reliability investigation of lead‐free soldered joints. Song‐bai Xue can be contacted at: xuesb@nuaa.edu.cn © Emerald Group Publishing Limited 2011 Finite element simulation Soldering Joining processes Stress (materials) Silver Copper Chemical elements...
Journal Articles
Microstructure and creep properties of Sn-Ag-Cu lead-free solders bearing minor amounts of the rare earth cerium
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2010) 22 (2): 30–36.
Published: 13 April 2010
... Thermodynamics Creep Chemical elements and inorganic compounds Owing to legislation, especially in Europe (e.g. the RoHS Directive), and market demand, the elimination of lead in electronic manufacturing has been a major activity in recent years (Xia and Xie, 2008 ; Zhang et al., 2008a...
