... solders. Design/methodology/approach This study introduced a Cu-10Ni (Wt. %) alloy layer coated on a pure Ni mesh, forming a Ni@Cu10Ni composite reinforcement. This hybrid mesh was incorporated into a SAC305 alloy to fabricate a composite solder, which was subsequently applied in low-temperature...

... composite solder containing 0.05 Wt.% TiN was prepared by powder metallurgy method. A temperature gradient generator was designed and the corresponding samples were also prepared. The microstructural evolution, internal structure and elemental content of SAC305 and SAC305/TiN solder joints before and after...

... and alloying element. Design/methodology/approach A composite solder was manufactured by mechanically introducing Ni particle reinforcements into a solder matrix. The effect of the non-reactive alloying elements, Ag, Pb and Bi, on the growth kinetics of the IMC formed between liquid Sn-based eutectic...

... ageing test was implemented under vacuum atmosphere at 150°C, whereas the EM experiment was carried out with a current density of 1.5 × 10⁴ A/cm². The microstructural and mechanical evolutions of both plain and composite solder joints after thermal ageing and EM stressing were...

...) © Emerald Publishing Limited 2017 Emerald Publishing Limited Licensed re-use rights only Composite solder Brinell microhardness Hardness test Lead-free solders Nanoindentation Vickers microhardness (1) HV = 2 F s i n 136 ° 2 d 2 = 1.854 F d 2...

...Guang Chen; Bomin Huang; Hui Liu; Y.C. Chan; Zirong Tang; Fengshun Wu Purpose The purpose of this paper is to investigate microstructure and properties of Sn3.0Ag0.5Cu-XAl₂O₃ composite solder which were prepared through powder metallurgy route. Design/methodology/approach...