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Journal Articles

Deformation behavior relationship between tensile and nanoindentation tests of SAC305 lead-free solder wire

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Izhan Abdullah, Muhammad Nubli Zulkifli, Azman Jalar, R. Ismail
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2018) 30 (3): 194–202.
https://doi.org/10.1108/SSMT-07-2017-0020
Published: 21 December 2017
... of this paper is to investigate the relationship between tensile and nanoindentation tests toward the mechanical properties and deformation behavior of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder wire at room temperature. Design/methodology/approach Tensile test with different strain rates of 1.5 × 10-4 s-1...
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Journal Articles

Deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) solder wire under varied tensile strain rates

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Izhan Abdullah, Muhammad Nubli Zulkifli, Azman Jalar, Roslina Ismail
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (2): 110–117.
https://doi.org/10.1108/SSMT-08-2016-0017
Published: 03 April 2017
...Izhan Abdullah; Muhammad Nubli Zulkifli; Azman Jalar; Roslina Ismail Purpose The purpose of this paper is to investigate the relationship between microstructure and varied strain rates towards the mechanical properties and deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder wire...
View article titled, Deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) solder wire under varied tensile strain rates
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