...Yukang Wang; Wumiao Gan; Daokuan Tang; Yaoting Wang; Yiying Zhu; Zhukun Zhou Purpose The purpose of this study is to reveal the electromigration-induced failure mechanisms in Cu–Cu hybrid bonding structures and to identify the key factors governing failure location and lifetime under multiphysics...

...Qiang Zhou; Zuocheng Niu; Yuan Hong; Zhijie Zhang; Mingliang Huang Purpose This study aims to investigate the interfacial reactions and electromigration (EM) behavior in Cu/Sn-9Zn/Cu and Cu/Sn-9Zn/Ni interconnects under high current density, focusing on the growth kinetics of intermetallic...

... of the joint. Also this study found that the heavy CX decreases the mechanical strength, but the degradation does not reach the level of electromigration (EM)-induced voiding. Practical implications The heavy CX significantly affects joint reliability and the results point out to EM-induced failure...

...Ervina Efzan Mhd Noor; Baaljinder R.; Emerson J. Purpose The purpose of this study is to investigate the effect of electromigration (EM) on solder alloy joint on copper with nickel surface finish. Sn-Bi solder alloy has been used in this research. Design/methodology/approach The EM process...