.... To overcome these limitations, a two steps analysis approach is proposed and can be effectively applied in the design of stencil screen printing. © Emerald Group Publishing Limited 2013 Stencil printing Solder paste Squeegee angle Squeegee speed Micro bumps Electronic engineering...

... Group Publishing Limited 2010 Adhesion Moisture Joining processes Electronic engineering Product reliability Personal and portable electronic devices are constantly becoming more common. In this situation, miniaturization techniques are extremely important. One problem...

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... the cure rate of polymer materials. Originality/value The findings of this paper will help to provide an understanding of the behaviour of thermosetting polymer materials during microwave cure processing. © Emerald Group Publishing Limited 2007 Polymers Microwaves Simulation Electronic...

.... Manufacturers searching for direction and example to meet waste minimization goals will find the paper useful in providing such. © Emerald Group Publishing Limited 2006 Solder Electronic engineering The electronics industry is reacting to the banishment of a widely used, constituent material...

... of the underlying core material. Such failure is going to be more prevalent with decreasing pad size and is potentially a limiting factor to decreasing interconnection pitch. Solders Joining processes Reliability management Electronic engineering With portable and hand‐held electronic products...

... thermally stable at 150°C than ODT or MAA. A possible explanation for the relative stability of this coating is the presence of a rigid benzene ring within its chemical structure, which is very thermally stable. Adhesives Joining materials Thermal stability Electronic engineering...

... © Emerald Group Publishing Limited 2005 --> X-rays Electronic engineering New zero defects testing system Keywords: X-rays, Electronic engineering Envisage Systems have launched a new, low cost online X-ray testing and inspection system, which enables electronic...

...Bob Willis © Emerald Group Publishing Limited 2005 --> Electronic engineering Books Solder Implementing Lead-Free Electronics Jennie S. HwangMcGraw-Hill Professional Engineering470 pp.10 chapters with diagrams and photographs Keywords: Electronic engineering...

... © Emerald Group Publishing Limited 2005 --> Electronic engineering Books IC Component Sockets Weifeng Liu and Michael PechtWiley Interscience216 pp.;12 chapters with illustrations and photographs Keywords: Electronic engineering, Books As the authors suggest...

... during the reflow process. Stress (materials) Finite element analysis Electronic engineering Bonding In general, sufficient heat and pressure should be applied to the ACF in order to cure the epoxy matrix of the ACF. During the pre‐bonding and bonding process, air may become trapped inside...