... Thermal aging Electronic packaging High-temperature reliability Intermetallic compounds Mechanical properties Sustainable materials Lead-free solder alloys are crucial in the electronics industry, serving as conductive materials that establish electrical interconnections between circuits...

... © 2025 Emerald Publishing Limited 2025 Emerald Publishing Limited Licensed re-use rights only Machine learning Electronic packaging Flip-chips Underfill encapsulation Voiding Dispensing orientations BJIM USMIndustry Matching Research Grant 1001.PMEKANIK.8070022 USM...

... Combining (3b) and (4) will yield the use case for all the three models in the masking process: 14 08 2024 09 09 2024 11 09 2024 © Emerald Publishing Limited 2024 Emerald Publishing Limited Licensed re-use rights only Machine learning Voiding Electronic packaging Flip...

... Licensed re-use rights only Electronic packaging Flip-chips Underfill encapsulation Voiding Machine learning BJIM USMIndustry Matching Research 1001.PMEKANIK.8070022 USM-Western Digital Corp 311/PMEKANIK/4402055 The miniaturisation of components such as a flip-chip uses...

... Li can be contacted at: xyli@bjut.edu.cn 09 04 2022 05 05 2022 09 05 2022 © Emerald Publishing Limited 2022 Emerald Publishing Limited Licensed re-use rights only Cu₃Sn solder joint Microstructure evolution Grain orientation Electronic packaging IMC...

...., 2014). As a result, this technology is successfully applied in electronic packaging (Lu et al., 2007 ; Göbl and Faltenbacher, 2010 ; Wang et al., 2013 ; Fu et al., 2014 ; Welker et al., 2015 ; Liu et al., 2018 ; Siow, 2019 ; Hng et al., 2020...

... lead-free solder alloy decreases the melting temperature to few degrees. Originality/value Development of holmium-doped eutectic Sn-Ag lead-free solder for electronic packaging. Rizk Mostafa Shalaby can be contacted at: doctorrizk2@yahoo.co.uk 05 10 2021 17 12 2021 30 12 2021...

... encapsulation Electronic packaging Voiding Recent advances in the microelectronics sector have demanded a smaller and more compact electronic device with higher performance, preferably at a lower manufacturing cost. Therefore, the first level interconnect technology of the flip-chip gained popularity...

... be contacted at: aizatabas@usm.my 02 10 2020 16 11 2020 01 03 2021 04 03 2021 © Emerald Publishing Limited 2021 Emerald Publishing Limited Licensed re-use rights only Electronic packaging Underfill encapsulation Analytical filling time model Capillary flow Flip-chip...

... and process enhancement. Electronic packaging Void formation Capillary underfill process Contact line jump Flip-chip Meniscus evolution The f_n denotes the fluid volume fraction of the n-th fluid in the multiphase system. In the current simulation with m...

..., the scaling limit and the inter-relatability between the scaled-up and actual systems has not been studied. 30 07 2019 29 08 2019 29 08 2019 © Emerald Publishing Limited 2019 Emerald Publishing Limited Licensed re-use rights only Flip-chips Scaling Electronic packaging...

...Peng Yao; Xiaoyan Li; Fengyang Jin; Yang Li Purpose This paper aims to analyze the morphology transformation on the Cu₃Sn grains during the formation of full Cu₃Sn solder joints in electronic packaging. Design/methodology/approach Because of the infeasibility of analyzing...

...Brian Ellis Conductive Adhesives for Electronics Packaging Editor Johan LiuElectrochemical Publications Limited, IOMPages 431+xv; Tables 38; Figures 329; References 457ISBN 0 901 150 37 1Price US$158URL: http://www.elchempub.com/epfiles/ep35.htm. Keywords: Publication, Adhesives...

... © MCB UP Limited 1999 --> Adhesives Dexter Electronic packaging Dexter introduces a breakthrough high thermally conductive die attach adhesive Keywords Adhesives, Dexter, Electronic packaging Quantum Materials, a business unit of Dexter Electronic Materials...