... Limited 2026 Emerald Publishing Limited Licensed re-use rights only Low-temperature interconnection Sintering Cu nanoparticle Nanoporous Cu Nanocopper arrays Electronic packaging Wide bandgap semiconductors Interconnects Natural Science Foundation of Henan Province-Key Program...

... 10 2025 03 11 2025 © 2026 Emerald Publishing Limited 2026 Emerald Publishing Limited Licensed re-use rights only Lead free solder alloy Indium doping Thermal aging Electronic packaging High-temperature reliability Intermetallic compounds Mechanical properties Sustainable...

... be contacted at: aizatabas@usm.my 29 11 2024 17 03 2025 25 03 2025 © 2025 Emerald Publishing Limited 2025 Emerald Publishing Limited Licensed re-use rights only Machine learning Electronic packaging Flip-chips Underfill encapsulation Voiding Dispensing orientations...

... Limited Licensed re-use rights only Machine learning Voiding Electronic packaging Flip-chips Underfill encapsulation Convolutional neural networks (CNN) have been expanding in applied computer vision for quality control in the microelectronics sector. One issue plaguing the multi...

... Emerald Publishing Limited Licensed re-use rights only Electronic packaging Flip-chips Underfill encapsulation Voiding Machine learning BJIM USMIndustry Matching Research 1001.PMEKANIK.8070022 USM-Western Digital Corp 311/PMEKANIK/4402055 The miniaturisation of components...

... Microstructure evolution Grain orientation Electronic packaging IMC Thermal aging Figure 4 Cross-sectional EBSD results of Cu₃Sn solder joints aged at 420°C for various durations Figure 2 shows the cross-sectional microstructure of the Cu₃Sn solder joint aged at 420°C...

... in electronic packaging (Lu et al., 2007 ; Göbl and Faltenbacher, 2010 ; Wang et al., 2013 ; Fu et al., 2014 ; Welker et al., 2015 ; Liu et al., 2018 ; Siow, 2019 ; Hng et al., 2020) where shear strength and both thermal and electrical resistivity...

... lead-free solder alloy decreases the melting temperature to few degrees. Originality/value Development of holmium-doped eutectic Sn-Ag lead-free solder for electronic packaging. Figure 1 X-ray diffraction patterns of the melt-spun alloys Sn-Ag lead-free solder Holmium rare earth...

... → ) = 0 , Flip-chips Finite volume method Underfill encapsulation Electronic packaging Voiding Recent advances in the microelectronics sector have demanded a smaller and more compact electronic device with higher performance, preferably at a lower manufacturing cost. Therefore...

... be contacted at: aizatabas@usm.my 02 10 2020 16 11 2020 01 03 2021 04 03 2021 © Emerald Publishing Limited 2021 Emerald Publishing Limited Licensed re-use rights only Electronic packaging Underfill encapsulation Analytical filling time model Capillary flow Flip-chip...

... and process enhancement. Electronic packaging Void formation Capillary underfill process Contact line jump Flip-chip Meniscus evolution The f_n denotes the fluid volume fraction of the n-th fluid in the multiphase system. In the current simulation with m...

..., the scaling limit and the inter-relatability between the scaled-up and actual systems has not been studied. 30 07 2019 29 08 2019 29 08 2019 © Emerald Publishing Limited 2019 Emerald Publishing Limited Licensed re-use rights only Flip-chips Scaling Electronic packaging...

...Peng Yao; Xiaoyan Li; Fengyang Jin; Yang Li Purpose This paper aims to analyze the morphology transformation on the Cu₃Sn grains during the formation of full Cu₃Sn solder joints in electronic packaging. Design/methodology/approach Because of the infeasibility of analyzing...

...Brian Ellis Conductive Adhesives for Electronics Packaging Editor Johan LiuElectrochemical Publications Limited, IOMPages 431+xv; Tables 38; Figures 329; References 457ISBN 0 901 150 37 1Price US$158URL: http://www.elchempub.com/epfiles/ep35.htm. Keywords: Publication, Adhesives...

... © MCB UP Limited 1999 --> Adhesives Dexter Electronic packaging Dexter introduces a breakthrough high thermally conductive die attach adhesive Keywords Adhesives, Dexter, Electronic packaging Quantum Materials, a business unit of Dexter Electronic Materials...