Update search
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
NARROW
Format
Journal
Type
Date
Availability
1-3 of 3
Keywords: Eutectic solder
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2012) 24 (1): 22–29.
Published: 03 February 2012
... Eutectic solder Micro‐impact test Low temperatures Instron The OM and SEM observations revealed that the specimens failed in three different failure modes: M1 displayed a clean fracture at the interface between the solder and the pad, with no solder remaining on the pad; M2 showed a fracture...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2001) 13 (2): 26–29.
Published: 01 August 2001
... in eutectic Sn‐Ag solder joints is that the service temperature of such joints would be limited by the lower melting temperature of the ternary eutectic phase. © MCB UP Limited 2001 Contamination Eutectic solder Lead‐free soldering Surface finishing Sn‐Pb solder alloys have been used...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2001) 13 (2): 21–25.
Published: 01 August 2001
... chip assemblies and might therefore be omitted. © MCB UP Limited 2001 Flip chip Eutectic solder Encapsulation Reliability This paper discusses processes for flip chip bonding on to ceramic substrates using eutectic tin‐lead solder bumps, with an underfill, and with or without...
