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Keywords: Flux
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Journal Articles
Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2022) 34 (2): 96–102.
Published: 23 August 2021
.... Design/methodology/approach Sn-5Sb-CuNiAg solder balls (750 µm in diameter) were spread and wetted on 40 × 40 × 1 mm copper plates, in different fluxes, soldering temperatures and time. The contact angles were obtained by a home-made measuring instrument. The samples were polished and deep etched before...
Journal Articles
Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2020) 32 (3): 157–164.
Published: 11 February 2020
... of different types of fluxes. Design/methodology/approach Solder pastes were prepared by mixing SAC305 solder powder with different flux and different wt.% of carbon nanotube (CNT). Fourier transform infrared spectroscopy was used to identify functional groups from different fluxes of as-formulated solder...
Journal Articles
Rheology of F620 solder paste and flux
Available to PurchaseFlavia V. Barbosa, José C.F. Teixeira, Senhorinha F.C.F. Teixeira, Rui A.M.M. Lima, Delfim F. Soares, Diana M.D. Pinho
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2019) 31 (2): 125–132.
Published: 18 December 2018
...Flavia V. Barbosa; José C.F. Teixeira; Senhorinha F.C.F. Teixeira; Rui A.M.M. Lima; Delfim F. Soares; Diana M.D. Pinho Purpose The aim of this paper is to characterize the rheological properties of the flux media exposed to different levels of solicitation and to determine its influence...
Journal Articles
Effect of fluxes on Sn-Zn-Bi solder alloys on copper substrate
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (4): 225–234.
Published: 04 September 2017
...Ervina Efzan Mhd Noor; Ayodeji Samson Ogundipe Purpose This paper aims to investigate the effect different fluxes have on the mechanical properties of lead-free solders, specifically Sn-Zn-Bi solder alloy. The solder billets were soldered in between copper substrates and flux was applied...
Journal Articles
Thermal decomposition of solder flux activators under simulated wave soldering conditions
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (3): 133–143.
Published: 05 June 2017
...Kamila Piotrowska; Morten Stendahl Jellesen; Rajan Ambat Purpose The aim of this work is to investigate the decomposition behaviour of the activator species commonly used in the wave solder no-clean flux systems and to estimate the residue amount left after subjecting the samples to simulated wave...
Journal Articles
Preparation of PEG-rosin derivative for water soluble rosin flux
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2016) 28 (4): 188–200.
Published: 05 September 2016
...Kanlaya Phaphon; Sumrit Wacharasindhu; Amorn Petsom Purpose This study aims to synthesize polyethylene glycol (PEG)-rosin derivatives from rosin and PEG for the production of solid soldering fluxes. The PEG-rosin derivatives would be water soluble, and the resulting solid soldering fluxes would...
Journal Articles
Relative effect of solder flux chemistry on the humidity related failures in electronics
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2015) 27 (4): 146–156.
Published: 07 September 2015
...Vadimas Verdingovas; Morten Stendahl Jellesen; Rajan Ambat Purpose – This paper aims to investigate the effect of no-clean flux chemistry with various weak organic acids (WOAs) as activators on the corrosion reliability of electronics with emphasis on the hygroscopic nature of the residue...
Journal Articles
Contamination profile on typical printed circuit board assemblies vs soldering process
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2014) 26 (4): 194–202.
Published: 26 August 2014
... of soldering processes. Typical solder flux residue distribution pattern, composition and concentration are profiled and reported. The effect of such contaminants on conformal coating was tested. Design/methodology/approach – Presence of localized flux residues was visualized using a commercial residue...
Journal Articles
Influence of the fluxes properties on quality and the microstructure of lead-free solder joints executed by selective soldering
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2014) 26 (1): 2–7.
Published: 28 January 2014
...Dr Agata Skwarek; Marek Koscielski; Janusz Sitek Purpose – The purpose of this paper is to investigate the influence of the properties of new compositions of fluxes for selective soldering on lead-free solder joints quality and microstructures as well as showing which flux properties are the most...
Journal Articles
Effect of particle size distribution (PSD) and flux medium on the creep recovery performance of lead‐free solder pastes
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2011) 23 (2): 75–84.
Published: 12 April 2011
...A.E. Marks; N.N. Ekere; S. Mallik; R. Bhatti Purpose The purpose of this paper is to investigate how the formulation of a solder paste (with regards to the flux and particle size distribution (PSD)), can influence its creep and recovery performance. Design/methodology/approach New lead‐free...
Journal Articles
Comparison of ROSE, C3/IC, and SIR as an effective cleanliness verification test for post soldered PCBA
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2011) 23 (2): 85–90.
Published: 12 April 2011
... practice for ionic contamination detection limits. Design/methodology/approach PCBAs were subjected to different flux residue cleaning dwell times and cleanliness levels were verified with resistivity of solvent extract, critical cleanliness control (C3) test, and ion chromatography analyses to provide...
Journal Articles
Solidification and wetting behaviour of SnAgCu solder alloyed by reactive metal organic flux
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2010) 22 (1): 19–25.
Published: 09 February 2010
...Patrick Zerrer; Andreas Fix; Matthias Hutter; Herbert Reichl Purpose The purpose of this paper is to develop a new alloying method for solders by using a metal organic modified flux in solder pastes. Design/methodology/approach This paper presents the impact of six metal organic compounds (Co...
Journal Articles
Solder paste characterisation: towards the development of quality control (QC) tool
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2008) 20 (3): 34–40.
Published: 27 June 2008
...R. Durairaj; S. Mallik; N.N. Ekere Purpose The purpose of this paper is to develop a quality control tool based on rheological test methods for solder paste and flux media. Design/methodology/approach The rheological characterisation of solder pastes and flux media was carried out through...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2005) 17 (1)
Published: 01 March 2005
... © Emerald Group Publishing Limited 2005 --> Flux AIM introduces 270WR VOC-free lead-free compatible wave solder flux Keywords: Flux AIM has introduced 270WR, a VOC- free, no-clean liquid flux formulated to offer a broad process window for lead- free and tin-lead...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2001) 13 (1)
Published: 01 April 2001
... Plate 2 Ecosol® MF101 from Multicore The flux's wide operating window is achieved by the thermally stable activator package being able to combine with the VOC-free carrier material(water). As a result, the flux remains more active throughout the wave soldering process, even...
Journal Articles
The solvent of choice
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2001) 13 (1): 19–25.
Published: 01 April 2001
...Tim Lawrence; Ian Wilding; Balvinder Chowdhary This paper outlines the current position of water based no‐clean liquid fluxes for wave soldering. The primary differences between these and “traditional” alcohol based liquid fluxes are explored using wetting balance methods. Reduced wetting...
Journal Articles
Surface insulation resistance (SIR) response to various processing parameters
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1999) 11 (2): 30–34.
Published: 01 August 1999
...Ling Zou; Christopher Hunt SIR testing is in practice carried out under a wider range of experimental conditions than those detailed in standards. The work presented here explores some of the issues when using a range of fluxes with various processing conditions and also examines the influence...
Journal Articles
An evaluation of the effect of ageing on the cleanability of solder flux residues
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1999) 11 (1): 27–35.
Published: 01 April 1999
...L. Zou; M. Duˇsek; C.P. Hunt; B.D. Dunn The efficiency of cleaning of flux residues after various periods of ageing was assessed by measuring the ionic contamination removed in an Ionograph 500 SMD. The flux residues were removed from bare boards, and boards with through hole and surface mount...
Journal Articles
The impact of temperature and humidity conditions on surface insulation resistance values for various fluxes
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1999) 11 (1): 36–43.
Published: 01 April 1999
... when using a typical resin flux, a weak organic flux and glycol based fluxes when sampling SIR patterns every ten minutes. Results indicate that some fluxes are very sensitive to the test temperature, with volatilisation of flux residues an important issue. The frequent monitoring of the results also...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1999) 11 (1)
Published: 01 April 1999
... © MCB UP Limited 1999 --> Flux Heraeus No-clean Soldering New no-clean, low solids liquid fluxes from Heraeus ready to use in air and nitrogen wave soldering applications Keywords Flux, Heraeus, No-clean, Soldering A high-performance solution, Surf 11 provides...
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