... of the micro solder joints increased at high temperatures and weakened the role of the hardening process (Liu et al., 2008). The creep deformation at the dwell time of the target load was also a function of the temperature, i.e. the higher temperature led to more severe creep deformation. Figure...

... and their causes is sought. High temperature Printed circuit boards Reflow Warpage For bare material, it is not easy to measure the out‐of‐plane modulus and Poisson’s ratio at temperatures typical of the reflow process as it is too flexible to keep straight when the force is applied. The sample...