... Reliability Thermal cycling Lifetime Heat dissipation performance Double-sided packaging structure Single-sided packaging structure It can be seen from Figure 6 that the temperature of the single-sided package structure on the SiC MOSFET was the highest, and the maximum junction temperature...

... influence on the bond heel lifetime. Originality/value The mechanical simulation is able to replace the time‐consuming lifetime experiments. Electronic control devices are exposed to large thermal and mechanical loads during operation. With regards to faster development cycles, electronic packaging...