... distribution of the solder joints in the POP packages under thermal-drop impact loading is determined. Furthermore, the relationship between the maximum peeling stress of the solder joints and the maximum number of drops is established based on the power law principle. Finally, the life prediction of critical...

... is 12. Under the thermal-drop impact load sequence coupling, the maximum peeling stress value appears at the edge of the contact area between the tip of the outermost fillet ball and the substrate, and the larger the height and smaller the diameter of the ball, the greater the ability to resist the drop...