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Keywords: Mechanical behaviour of materials
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Journal Articles
Reliability evaluation of SnAgCu/SnAgCuCe solder joints based on finite element simulation and experiments
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2010) 22 (4): 57–64.
Published: 21 September 2010
... numerical simulation by the finite element method has been carried out for understanding the effects of RE elements on the reliability of SnAgCu solder joints. Solder Alloys Finite element analysis Creep Metals Mechanical behaviour of materials The Sn3.8Ag0.7Cu alloy system has been...
Journal Articles
Effect of stand‐off height on the microstructure and mechanical behaviour of solder joints
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2010) 22 (1): 11–18.
Published: 09 February 2010
.... This is because of the inherent deviation from the clamping apparatus and the consumption of the copper base by interfacial reactions in the reflow process. © Emerald Group Publishing Limited 2010 Tensile strength Mechanical behaviour of materials Soldering Joining processes...
