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Keywords: Micro solder joints
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2016) 28 (3): 167–174.
Published: 06 June 2016
...Xiangxia Kong; F. Sun; Miaosen Yang; Yang Liu Purpose This paper aims to investigate the creep properties of the bulks of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints from 298 to 358 K. The creep constitutive modelling was developed. Meanwhile, the creep mechanism of the bulks of Cu/Sn-Ag-Cu-Bi...
