...Guang Chen; Yao-Feng Wu Purpose The purpose of this paper is to investigate the effect of titanium nitride (TiN) on microstructure and composition of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder joints under a large temperature gradient. Design/methodology/approach In this paper, SAC305 lead-free...

...Guang Chen; Xinzhan Cui; Yaofeng Wu; Wei Li; Fengshun Wu Purpose The purpose of this paper is to investigate the effect of fullerene (FNS) reinforcements on the microstructure and mechanical properties of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder joints under isothermal ageing and electrical...

...Guang Chen; Jiqiang Li; Xinwen Kuang; Yaofeng Wu; Fengshun Wu Purpose The purpose of this paper is to investigate the effect of nickel-plated graphene (Ni-GNS) on the microstructure and mechanical properties of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder joints before and after an electro-migration...

...L. Ye; Z.H. Lai; J. Liu; A. Thölén Identifies the intermetallics formed in Sn‐0.5Cu‐3.5Ag and Sn‐3.5Ag‐0.5Cu‐0.5B (wt%) lead‐free solders, and the influence of boron on these precipitates. SEM, TEM and SIMS were employed to reveal the difference of microstructure in both solder alloys. It was found...

...Qinong Zhu; Mei Sheng; Le Luo The effects of Pb contamination on the microstructure and shear strength of lead‐free solder joints with non‐lead containing finishes on both the PCB and terminals of 1,206 chip capacitors at different temperatures were investigated. Two kinds of lead‐free solders...

...X.M. Xie; T.B. Wang; J.Z. Shi; R.Q. Ye; F. Stubhan; J. Freytag Au/In isothermal solidification technique was evaluated as an alternative method for high performance die attachment. Bonding could be achieved at temperatures between 250°C ‐ 3008C for about five to ten seconds. The microstructures...