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Keywords: POP package
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2025) 37 (5): 386–396.
Published: 24 June 2025
.... Design/methodology/approach In this study, the influence of five different chip power sizes on the Sn0.3Ag0.5Cu (SAC305) solder joints in Package-on-Package (POP) structures under thermal-drop impact load is systematically investigated. The board-level POP package structure is modeled using finite...
