... health and this had led to the use of Pb-free joints as alternatives for conventional Pb-Sn solder alloys (Ku et al., 2003 ; Braga et al., 2007). The most common lead-free solders are tin-silver-copper, tin-bismuth and tin-zinc alloys (EL-Daly et al., 2009 ; Kamal and Goda...

... rights only Pb-free Sn-Ag-Cu Finite element modelling (FEM) Thermal fatigue Reliability Fatigue life Thermal interface materials SAC solders Modelling The operation of microelectronic devices in a wide range of environments has led to different types of failures, and this is a major...

... in low temperature electronic assembly. Guang Ren can be contacted at: guang.ren@ul.ie 24 05 2020 06 08 2020 09 09 2020 20 09 2020 © Emerald Publishing Limited 2020 Emerald Publishing Limited Licensed re-use rights only Alloys Pb-free Creep Low temperature...

... alloys Microstructural and microhardness change Thermal properties Differential scanning calorimetry (DSC) Microstructure Pb-free Sn-Ag-Cu Solder alloys Osvaldo Fornaro can be contacted at: ofornaro@exa.unicen.edu.ar 26 03 2020 19 05 2020 02 06 2020 ©...

... at: nobari@alumni.ubc.ca 08 08 2015 29 09 2015 05 10 2015 © Emerald Group Publishing Limited 2016 Emerald Group Publishing Limited Licensed re-use rights only Pb-free Solder alloys Wetting Contact angle For many years, tin–lead alloys have been the most prominent...

... by the linear dimensions of the sample holder. Therefore, a method was worked out to validate the CT crack length measurements and to enable the optimization of CT capture settings. Pb-free Interfacial cracking X-ray imaging Computed tomography Thermal shock test Vapour phase soldering...

... in their composition and growth conditions, the Ni concentration and their nucleation interface play a critical role. Flip-chips Pb-free Microstructure Interconnections Intermetallic compounds Reflow Solder joints work as interconnections in most electronic packages, and they are often the weakest...

... be possible. SAC tertiary Pb-free solders are thought to be the best substitutes for Pb-based solders but have limitations due to their coarse microstructure. Design/methodology/approach – Three samples with varied La concentrations were synthesized from pure metals. SAC with various concentrations...

... of electronic devices (Shaefer et al., 1996). As a result, extensive research has been performed in the past decade on solder/Cu interface reactions (Ma et al., 2002). R* = normalized spatial coordinate T* = normalized time © Emerald Group Publishing Limited 2015 Pb-free...

...Yunfei Du; Chuntian Li; Bin Huang; Ming Tang; Changhua Du Purpose – This paper aims to identify a variety of binary system solders by alloying, and relevantly derive multiple system Pb-free solders from the former, attempting to replace the high temperature Sn-Pb solder. Design/methodology...

... characteristics and the fundamental factor involving the SAC solder is still not sufficient. Henceforth, this paper resolves in stating all its important properties based on the SAC solder including its alloying of elements and nanoparticles addition for further understanding. Findings – Various Pb-free...

...Robert W. Kay; Gerard Cummins; Thomas Krebs; Richard Lathrop; Eitan Abraham; Marc Desmulliez Purpose – Wafer-level stencil printing of a type-6 Pb-free SAC solder paste was statistically evaluated at 200 and 150 μm pitch using three different stencil manufacturing technologies: laser...

... was performed in a scanning electron microscope (SEM). SEM analysis of the cross-sections showed the presence of voids in each analyzed sample. As can be seen in Figure 1 , the worst results (the biggest number of voids) were obtained for the Pb-free sample soldered without vacuum (Figure 1(1...

... wetting properties. © Emerald Group Publishing Limited 2014 Intermetallic compounds Pb-free Solder joints Flux Selective soldering Most of the components used in medical applications, measurement and control and other highly reliable devices are mounted on printed circuit...

... properties will enable better and more reliable nanocomposite solders to be implemented in electronic manufacturing applications. Intermetallic compounds Microstructure Shear strength Alloys Pb‐free Soldering is a renowned metallurgical joining method which uses a filler metal, the solder...