Keywords: Printed circuit boards
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Journal Articles
Soldering & Surface Mount Technology (2025) 37 (3): 223–233.
Published: 14 January 2025
... systems: direct copper bonded (DCB), insulated metal substrate (IMS) and printed circuit board (PCB) configurations examined. In addition, three lead-free bonding materials: silver-tin transient liquid phase (TLP), sintered silver (Ag) and sintered copper (Cu). This results in nine assembly configurations...
Journal Articles
Soldering & Surface Mount Technology (2004) 16 (2)
Published: 01 August 2004
...Bob Willis © Emerald Group Publishing Limited 2004 --> Reference Books Printed circuit boards Soldering Electronics Keywords: Reference, Books, Printed circuit boards, Soldering,Electronics Area Array Interconnection Handbook Karl Puttlitz and Paul...
Journal Articles
Soldering & Surface Mount Technology (2003) 15 (3)
Published: 01 December 2003
... magnification to make its placement and registration fast and accurate. This is an essential feature when reworking larger fine-pitch components. For more details, visit the Web site: www.okinternational.com © MCB UP Limited 2003 --> Printed circuit boards Metcal rework system now...
Journal Articles
Soldering & Surface Mount Technology (2003) 15 (2): 22–27.
Published: 01 August 2003
... pastes Printed circuit boards Assembly Cyclic bending tests and shear tests, as well as cross‐sectioning, were done to check the solder joint integrity. The cyclic bending test consisted of a two‐point anvil structure with are moving beam (Figure 6). The total displacement was 2 mm...
Journal Articles
Soldering & Surface Mount Technology (2003) 15 (2): 28–34.
Published: 01 August 2003
...Teo Kiat Choon It was observed that “no solder” or “skipped solder” defects occurred on a particular printed circuit board assembly product during wave soldering. Investigations were carried out to find out the cause of this defect and to recommend an optimal hot air level coating thickness...
Journal Articles
Soldering & Surface Mount Technology (2003) 15 (1)
Published: 01 April 2003
... the minimum fire safety standards. Current bromine-containing flame retardants are to be phased out due to their toxicity and their reported generation of highly toxic dioxin species during incineration processes. © MCB UP Limited 2003 --> Printed circuit boards Flame resistant Tin...
Journal Articles
Soldering & Surface Mount Technology (2002) 14 (3): 12–18.
Published: 01 December 2002
..., low temperature) and SH (conventional profile, high peak temperature). Reflow soldered pads were inspected using X‐ray examination to reveal the numbers and sizes of internal voids. © MCB UP Limited 2002 Lead‐free soldering Printed circuit boards Reliability Over the past 15...
Journal Articles
Journal Articles
Journal Articles
Soldering & Surface Mount Technology (2001) 13 (3)
Published: 01 December 2001
... © MCB UP Limited 2001 --> Recycling Components Printed circuit boards Tin Up machine recycles used components Keywords: Recycling, Components, Printed circuit boards Applied Microtech has just launched its first machine dedicated to the recycling of components...
Journal Articles
Soldering & Surface Mount Technology (2001) 13 (3)
Published: 01 December 2001
... Surface Mount Technology(SMT) manufacturing process – the state-of-the-art approach to assembling printed circuit boards. Ten courses in Level 2 cover the fundamentals of each aspect of the SMT process in much greater detail. Level 3 courses provide complete information concerning the operation of ten...
Journal Articles
Journal Articles
Soldering & Surface Mount Technology (2000) 12 (2)
Published: 01 August 2000
... circuit boards. GenRad's TestStation Accelerate is available in two architectures: the TS 121 and the TS 8X. The TS121 is an all-real pin system, providing non-multiplexed test resources for every node on the printed circuit board. This capability allows for improved testing of densely integrated...
Journal Articles
Soldering & Surface Mount Technology (2000) 12 (2)
Published: 01 August 2000
.... Tel: +49 89 418 61(0) 249; Fax: +49 89 418 61-110; E-mail: sandra.winter@teradyne.com Teradyne Automated optical inspection Printed circuit boards Keywords Teradyne, Automated optical inspection, Printed circuit boards Teradyne has introduced its new Optima 7300 Post-Reflow...
Journal Articles
Soldering & Surface Mount Technology (2000) 12 (1)
Published: 01 April 2000
... © MCB UP Limited 2000 --> JOT Automation Handling Testing Printed circuit boards JOT Automation introduces mobile phone test handlers for both PCB and final testing Keywords: JOT Automation, Handling, Testing, Printed circuit boards JOT Automation Ltd has...
Journal Articles
Soldering & Surface Mount Technology (2000) 12 (1)
Published: 01 April 2000
... © MCB UP Limited 2000 --> GraphiCode Software Assembly Printed circuit boards GraphiCode introduces GC-PLACE 4.1.2 for Windows™ Keywords: GraphiCode, Software, Assembly, Printed circuit boards GC-PLACE 4.1.2 is a PC-based software package that generates...
Journal Articles
Soldering & Surface Mount Technology (2000) 12 (1)
Published: 01 April 2000
... © MCB UP Limited 2000 --> PMJ Cencorp Printed circuit boards PMJ Cencorp expands product line with new low-cost depaneling system Keywords: PMJ Cencorp, Printed circuit boards The TR5300 In-Line Automated Routeing System and the WR700 StandAlone Workstation...
Journal Articles
Soldering & Surface Mount Technology (2000) 12 (1)
Published: 01 April 2000
... © MCB UP Limited 2000 --> Excellon Printed circuit boards Excellon automation announces first depanelization line Keywords: Excellon, Printed circuit boards Excellon announces the development of its first system for the Excellon depanellization line of equipment...
Journal Articles
Soldering & Surface Mount Technology (1999) 11 (3)
Published: 01 December 1999
... Keywords CyberOptics, Inspection, Printed circuit boards CyberOptics has introduced the FirstCheck™ off-line PCB verification system for first-article inspection (Plate 4). Using FirstCheck, operators can finish post-placement or postreflow inspection three to five times faster than...
Journal Articles
Soldering & Surface Mount Technology (1999) 11 (3)
Published: 01 December 1999
... © MCB UP Limited 1999 --> Siemens Placement Printed circuit boards Throughput The SIPLACE Productivity Lift can be integrated with all SIPLACE equipment; the SIPLACE HS 50, 80 S 20 and the new 80 S 23 (HM) high-speed machines; the 80 F4 and 80 F5 high-flexibility machines...

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