...Guisheng Gan; Shiqi Chen; Liujie Jiang; Qianzhu Xu; Tian Huang; Dayong Cheng; Xin Liu Purpose This study aims to evaluate the effect of thermal aging temperature on the properties of Cu/Al joints. Design/methodology/approach A new method in which 1 µm Zn-particles and SAC0307 with a particle...

... (SAC0307) with a particle size of 25–38 µm were mixed to fill the joint and successfully achieved the micro-joining of Cu/Cu under ultrasonic-assisted at low-temperature, and then the effect of thermal aging temperature on the properties of Cu/Cu joints was researched. Findings The composition...

... in the authors’ early work, but slag inclusion and pore would gather and grow up to lead decreasing of the shear strength. In this paper, Cu/SAC0307 +Zn power/Cu joints with ultrasonic-assisted at low-temperature was successfully achieved. Design/methodology/approach 45um Zn-powder and SAC0307 No.4 solder...

...Xingchen Yan; Kexin Xu; Junjie Wang; Xicheng Wei; Wurong Wang Purpose The purpose of this paper is to comparatively investigate the microstructure and interfacial intermetallic compound (IMC) layer of Cu/SACPG/Ni and Cu/SAC0307/Ni solder joints after thermal aging. Design/methodology/approach...