... service conditions. Design/methodology/approach Three configurations (unreinforced, corner epoxy bonding and corner L-shaped epoxy bonding) were compared. Finite element simulation – incorporating modal, random and sinusoidal vibration analyses – was used to screen the optimal reinforcement scheme...

... The temperature distribution and current density distribution of the interconnect structure of electronic devices were investigated through finite element simulations. During the experimental process, the actual temperature of the solder joints was measured and was used to optimize the finite element model...

... and the determined lifespan. Therefore, the lifespan can be calculated by mechanical‐plastic simulation for various loop geometries and loading cases. Practical implications The loop height strongly influences the durability of the wire bond, whereas other parameters, such as the loop angle, have a weaker...

... the cure rate of polymer materials. Originality/value The findings of this paper will help to provide an understanding of the behaviour of thermosetting polymer materials during microwave cure processing. © Emerald Group Publishing Limited 2007 Polymers Microwaves Simulation Electronic...

... predicted by the FE simulation were found to diminish significantly when applying the delaminating layer. In addition, parametric FE analysis was also applied in this study, and based on the design concepts within this study, a robust novel SJP‐WLCSP could be achieved. Originality/value In this work...

... 199°C which is close to that of the conventional Sn‐Pb solder which has previously been used in the electronics assembly industry. Design/methodology/approach Three dimensional finite element (FE) simulation analysis was used for comparison with the experimentally measured data and to determine...

... compared to the Sn‐37Pb solder joints. The cross section observation indicated that the fatigue cracks propagated along the interface between the solder bulk and the Au/Ni layer. The locations of maximum equivalent stress from the FE simulation were found to be at the two opposite corners of the solder...

... from the conventional model in the literature where plasticity and creep are artificially separated. Model simulations and verifications reveal that there is good agreement between the model predictions and experimental data. Some discussion on this unified model is also presented. This viscoplastic...