... and bottlenecks and provide theoretical support and technical references for industrial applications to sectors including new energy vehicles and 5G/6G communications. Design/methodology/approach This study reviews synthesis, anti-oxidation and sintering mechanisms of Cu nanoparticles, nanoporous Cu and 1D...

...Yang Liu; Hao Zhang; Lingen Wang; Xuejun Fan; Guoqi Zhang; F. Sun Purpose Crack and stress distribution on dies are key issues for the pressure-assisted sintering bonding of power modules. The purpose of this research is to build a relationship among stress distributions, sintering sequences...

...Yunhui Mei; Gang Chen; Xin Li; Guo‐Quan Lu; Xu Chen Purpose The purpose of this paper is to determine: how much the residual curvature could be formed in sintered nano‐silver assembly when it is cooled to room temperature from the sintering temperature (normally 275°C); how the cyclic temperature...

...Xin Li; Gang Chen; Xu Chen; Guo‐Quan Lu; Lei Wang; Yun‐Hui Mei Purpose The purpose of this paper is to evaluate the mechanical properties of nano‐silver paste sintered lap shear structures and to discuss the effects of loading rate and ambient temperature on shear strength and fracture mechanism...

...Kun Qi; Xu Chen; Guo‐Quan Lu Purpose Traditional chip‐level interconnection materials show many weaknesses given the development trend of microelectronic packaging technology. In order to meet the needs of high‐temperature packaging for wide‐bandgap semiconductors, low‐temperature sintered nano...