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Keywords: Sn58Bi solder
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Journal Articles
Effect of adding Ni nanoparticles on the melting characteristics, mechanical properties and intermetallic compound growth of Sn58Bi solder
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2025) 37 (1): 60–70.
Published: 20 November 2024
...Jiamin Zhang; Liang Zhang; Xi Huang; Chuanjiang Wu; Kai Deng; Wei-Min Long Purpose This paper aims to investigate the improvement of Sn58Bi solder properties by Ni nanoparticle to provide theoretical support in the field of electronic packaging. Design/methodology/approach In this study...
Journal Articles
Effect of Si3N4 nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2024) 36 (1): 8–19.
Published: 22 September 2023
... in the electronic packaging industry. Design/methodology/approach This study investigates the effect of adding Si3N4 NWs to Sn58Bi solder in various mass fractions (0, 0.1, 0.2, 0.4, 0.6 and 0.8 Wt.%) for modifying the solder and joining the Cu substrate. Meanwhile, the melting...
