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1-4 of 4
Keywords: Taguchi method
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Journal Articles
Optimizing stencil printing parameters for multiple quality characteristics and diverse packages using a hybrid neural network and linear programming approach
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2026) 38 (1): 32–49.
Published: 30 July 2025
... printing Multi-responses optimization Grey relational analysis Fuzzy logic Taguchi method Neural network Surface mount technology (SMT) is a pivotal methodology in modern printed circuit board (PCB) assembly. Rising demand for miniaturized electronics, such as telecommunication devices, drives...
Journal Articles
Optimisation of electroless nickel electroless palladium immersion silver (ENEPImAg) surface finish parameters using the Taguchi method for enhanced solder joint reliability
Available to PurchaseRabiatul Adawiyah Mohamed Anuar, Anuar Ismail, Norhasikin Ismail, Ishkrizat Taib, Nur Syamila Abd Latif, Izza Farisha Hamdan, Siti Aisyah A Razak
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2025) 37 (4): 279–295.
Published: 20 March 2025
... joint reliability. Due to its advantages, this study aims to focus on optimising a new surface finish known as electroless nickel electroless palladium immersion silver (ENEPImAg) to reduce surface roughness. Design/methodology/approach The optimisation process used the Taguchi method, using...
Journal Articles
Application of multi-quality parameter design in the optimization of underfilling process – a case study of a vehicle electronic module
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2021) 33 (2): 128–138.
Published: 08 October 2020
.../methodology/approach The Taguchi method is applied to configure the orthogonal table and schedule and execute the experiment. In addition, principal components analysis is used to obtain the points. Then, based on gray relational analysis and the technique for order preference by similarity to ideal solution...
Journal Articles
Stress analysis and structural optimization of 3-D IC package based on the Taguchi method
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2020) 32 (1): 42–47.
Published: 13 August 2019
... et al., 2018). Finite element modelling (FEM) Stress analysis Finite element analysis Taguchi method Solder joint reliability 3D IC package Figure 5 Von Mises stress distribution of the 3-D package At present, the main problems that restrict the development of 3-D IC...
