... at sintering temperatures of 230 °C for three minutes, to forcibly induce distinct porosity levels. Subsequently, tensile tests were carried out at strain rates of 10⁻⁴ and 10⁻⁵ s⁻¹, and at room temperature and at 200 °C. Findings The porosity level, as extracted from...

... be contacted at: ggs@cqut.edu.cn 30 12 2019 19 05 2020 27 06 2020 © Emerald Publishing Limited 2020 Emerald Publishing Limited Licensed re-use rights only Sn-37Pb Thermal shock Shear strength Failure Tearing crack Microstructure Solder bumps Fatigue Tensile testing...

... of the samples before doing the EM and tensile test. EM test was carried out at 24, 48, 72 and 96 h on both Cu and Ni substrates. A 12-V DC adapter was used with current of 1 A to conduct EM test as shown in Figure 3 . Two 12-V adapters are used to accelerate the process, as 15 pieces of Cu and 15 pieces...

... © Emerald Group Publishing Limited 2015 Microstructure Pb-free Optimization Lanthanum SAC alloys Tensile testing Excellent thermal and mechanical properties are desired in any solder joint. Such good properties were well-established for tin–lead (Sn-Pb) solders until...